Glass-Ceramic Packaging Substrate With Crack-Stopping Core Structures
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving high manufacturing yield due to crack issues at the edges or side surfaces of substrates, particularly with ceramic substrates having high resistance or high dielectric permittivity, and resin substrates limited in reducing line pitch, which affects electrical performance.
Innovation Solution
A substrate with a glass or ceramic core divided into product and dummy regions, incorporating crack stopping structures like grooves or vias to prevent crack propagation, along with a side surface protection layer and stabilization layer to enhance durability and prevent damage during the packaging process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ceramic substrate is used for packaging, then high-frequency semiconductor elements can be mounted, but manufacturing yield deteriorates due to cracks at edges or side surfaces
Solution Approach 1:
The patent applies preliminary action by forming crack stopping structures (grooves or vias) at predetermined locations on the ceramic substrate before mounting semiconductor elements. These structures are pre-positioned to intercept and stop cracks at their propagation paths, preventing edge cracks from reaching the product region and thereby maintaining high manufacturing yield while preserving electrical performance
Solution Approach 2:
The patent converts the harmful effect of cracks into a beneficial outcome by designing crack stopping structures that deliberately create controlled interruptions in the substrate. These structures allow cracks to stop at predetermined locations rather than propagating freely, transforming the potential damage into a protective mechanism that actually improves manufacturing yield
2Productivity
If resin substrate is used for packaging, then manufacturing yield is improved, but line pitch reduction is limited affecting electrical performance
Solution Approach 1:
The patent employs composite materials by combining ceramic substrate (for high-frequency performance) with protective features (grooves, vias, and protection layers) that compensate for the ceramic's brittleness. This composite approach allows the substrate to achieve both the electrical performance of ceramic and the crack resistance needed for high manufacturing yield
3Productivity
If crack stopping structures are added to prevent crack propagation, then manufacturing yield is improved, but device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the substrate into functional regions: a product region for mounting semiconductor elements and a dummy region containing crack stopping structures. This segmentation allows the protective features to be concentrated in specific areas without interfering with the product region, thereby improving manufacturing yield while minimizing the impact on overall device complexity
Data Source
AI summary
An embodiment relates to a substrate and a semiconductor module. A substrate capable of manufacturing a substrate for packaging, which is an individual product, with excellent yield despite cracks that may occur at edges or side surfaces of a core is provided. The substrate comprises a core as a glass or ceramic support, wherein the substrate is divided into a product region and a dummy region, the product region is a region where one or more individual products are disposed, the dummy region is a region of the substrate other than the product region, a breakage prevention portion is disposed in the product region or the dummy region, wherein the breakage prevention portion is a region in which one or more crack stopping structures are disposed, and the crack stopping structure is grooves or vias who stops cracks generated from the side of the core from growing toward the center of the individual product, and wherein the groove is a depression in a surface of the core, and the via is a through hole that has been removed so that a portion of the core being penetrate in a thickness direction.