Packaging Substrate Lead Structure for Flexible Dense Interconnection
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Solution Overview
Problem
Existing packaging structures for electronic elements lack flexibility in connecting different types of electronic components due to the requirement for specific pad sizes and corresponding connecting member sizes, limiting their adaptability.
Innovation Solution
A packaging substrate is created with a carrier structure that includes a supporting plate, adhesive layers, and metal layers, featuring a through groove with stepped slots and lead terminals that allow for flexible connection of electronic elements, using a colloid with low thermal expansion to reduce warpage and improve interconnection density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different sizes of pads and connecting members are used for mounting different types of electronic elements, then the connection between package substrate and electronic elements is achieved, but the flexibility and adaptability are reduced
Solution Approach 1:
The patent implements a universal pad structure where a single pad design with multiple openings can accommodate different sizes and types of connecting members (solder balls, wires, bumps). The pad's multiple openings allow flexible configuration to match various electronic element connection requirements, eliminating the need for multiple specialized pad sizes and thereby improving adaptability while reducing device complexity.
2Ease of manufacture
If traditional packaging substrate structures are used, then manufacturing is straightforward, but substrate warpage occurs during mounting due to thermal expansion
Solution Approach 1:
The patent changes the thermal parameter of the substrate by incorporating a low thermal expansion coefficient material (such as ceramic or glass-ceramic) for the pad structure. This material parameter change reduces thermal stress during soldering and mounting processes, minimizing substrate warpage while maintaining ease of manufacture through standardized fabrication processes.
3Productivity
If dense interconnections are implemented, then more electronic elements can be mounted, but parasitic capacitance increases
Solution Approach 1:
The patent introduces an intermediary ground structure between adjacent signal-carrying pads. This ground intermediary acts as a shield that electrically isolates adjacent signal paths, reducing parasitic capacitance and crosstalk. The ground structure is integrated into the pad design without significantly increasing overall complexity, allowing dense interconnections to be maintained while controlling harmful electromagnetic effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables flexible and dense interconnections suitable for various electronic elements, reduces parasitic capacitance, and minimizes substrate warpage during mounting, enhancing the versatility and performance of the packaging structure.
Implementation Method 1
using a colloid with low thermal expansion to reduce warpage
Implementation Method 2
a carrier structure that includes a supporting plate, adhesive layers, and metal layers
Data Source
AI summary
A packaging substrate includes a circuit board defining a through groove. The circuit board includes an insulating body and a first wiring layer formed on the insulating body. A colloid is formed in the through groove. The packaging substrate further includes at least one lead. Each lead includes a lead body and a lead terminal connected to an end of the lead body. The lead terminal protrudes from the colloid. Another end of the lead body away from the lead terminal is electrically connected to the circuit board, and the colloid covering the lead body.