Packaging Substrate With Holder For Thin Core Strength
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Solution Overview
Problem
Current semiconductor packaging substrates face challenges with miniaturization, as reduced thickness leads to poor production operability, increased risk of bending or breaking, and prolonged fabrication times due to deep through holes and poor electroplating performance.
Innovation Solution
A packaging substrate with a holder comprising a copper clad laminate and a strengthened board, featuring a dielectric layer, metal stripping layers, and conductive pads, which allows for thinner core layers and improved strength, enabling efficient electroplating and reduced laser penetration risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of the core layer is reduced to achieve miniaturization, then the package unit size is reduced, but the production operability deteriorates and the risk of bending or breaking increases
Solution Approach 1:
The packaging substrate is divided into two functional parts: a thin core layer (thickness < 60 μm) for miniaturization and a holder structure for mechanical support. The holder includes a copper clad laminate and a strengthened board that provides structural integrity during production and transportation, while the thin core layer achieves the desired small package size.
Solution Approach 2:
The holder is constructed as a composite structure combining copper clad laminate (providing electrical conductivity and structural support) with a strengthened board (providing enhanced mechanical strength). This composite design allows the overall substrate to maintain high strength despite the thin core layer, preventing bending and breaking during production operations.
2Volume of moving object
If the thickness of the core layer is reduced to achieve miniaturization, then the package unit size is reduced, but the structural strength deteriorates
Solution Approach 1:
The substrate structure is segmented into a thin core layer for miniaturization and a separate holder structure for strength. The holder comprises a copper clad laminate bonded to a strengthened board, creating a composite support structure that compensates for the reduced thickness of the core layer and maintains overall structural strength.
Solution Approach 2:
A composite holder structure is formed by bonding a copper clad laminate to a strengthened board. This composite design provides enhanced mechanical strength and rigidity to support the thin core layer, preventing bending and breaking while enabling the core layer thickness to be reduced below 60 μm for miniaturization.
3Adaptability or versatility
If the depth of through holes is increased to accommodate deep circuit structures, then the circuit functionality is improved, but the electroplating performance deteriorates and voids occur
Solution Approach 1:
Metal stripping layers are formed on the strengthened board before the core layer is attached. These preliminary metal layers serve as electroplating seeds that extend into the deep through holes, providing a conductive base for subsequent electroplating operations. This preliminary action ensures that electroplating can proceed effectively even in deep holes, preventing void formation and ensuring complete copper filling.
4Productivity
If the laser energy is increased to penetrate deep through holes, then the drilling efficiency is improved, but the risk of penetrating the copper layer increases
Solution Approach 1:
Metal stripping layers are preliminarily formed on the strengthened board before core layer attachment. These stripping layers act as intermediate targets that absorb and dissipate laser energy, allowing deep through holes to be drilled efficiently without the laser directly penetrating the copper layer. This preliminary structure enables high drilling efficiency while preventing harmful copper layer penetration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the strength and reliability of the packaging substrate, reduces fabrication time and costs, and prevents defects like bending and voids, while maintaining miniaturization requirements.
Implementation Method 1
a plurality of through holes are formed in the core layer from the second surface of the core layer via a laser drilling technique
Implementation Method 2
The copper layers are patterned. First and second circuit layers are respectively formed on the first and second surfaces by electroplating through a conductive seed-layer
Data Source
AI summary
A packaging substrate includes a holder, a first conductive pad disposed on the holder, a core layer disposed on the holder, a circuit layer disposed on the core layer, a plurality of conductive vias disposed in the core layer, and an insulating protection layer disposed on the core layer, wherein the first electrical pad is embedded in the core layer. By combining the holder on one side of the packaging substrate, cracks due to over-thinness can be prevented during transferring or packaging. A method of fabricating the packaging substrate, a package structure having a holder, a method of fabricating the package structure are also provided.