Packaging Substrate Interconnects Without Laser Via Drilling
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Solution Overview
Problem
The manufacture of packaging substrates for high-performance computing requires tight process control between laser drilling and copper plating, especially for high-aspect-ratio via plating, and involves high costs and technical limitations due to the use of laser drilling processes.
Innovation Solution
A laser-less manufacturing process is employed to form packaging substrates using a combination of line plating, via plating, dielectric material deposition, and planarization processes to create interconnect-level structures, eliminating the need for laser drilling and reducing aspect ratios of metal via structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser drilling process is used to form via holes, then via holes can be formed with precise dimensions, but the process requires tight process control and has high manufacturing costs
Solution Approach 1:
The patent extracts and eliminates the laser drilling process from the manufacturing flow, replacing it with mechanical drilling followed by electroplating. This removes the source of the technical contradiction by substituting a simpler, more controllable process while maintaining via hole formation capability.
Solution Approach 2:
The patent replaces the optical/thermal laser drilling system with a mechanical drilling system followed by electrochemical plating. This substitution allows for better process control and reduces manufacturing complexity while achieving the same functional result of forming conductive via holes.
2Productivity
If laser drilling process is used, then via holes can be formed quickly, but the manufacturing cost increases significantly
Solution Approach 1:
The patent removes the expensive laser drilling step from the process flow, replacing it with conventional mechanical drilling and electroplating. This extraction eliminates the high cost associated with laser equipment and operation while maintaining productive throughput through efficient electroplating.
Solution Approach 2:
The patent employs conventional, readily available mechanical drilling and electroplating equipment instead of expensive laser drilling systems. These simpler, more accessible processes reduce manufacturing costs while achieving the same production objectives.
3Manufacturing precision
If high-aspect-ratio via plating is performed, then via holes can be filled with metal, but the process becomes more difficult and less reliable
Solution Approach 1:
The patent performs preliminary mechanical drilling to create via holes with optimized dimensions and surface characteristics before electroplating. This preliminary action prepares the via holes in a way that facilitates more reliable and easier electroplating, reducing the difficulty of filling high-aspect-ratio vias.
Solution Approach 2:
The patent changes the via hole formation parameters by using mechanical drilling with specific depth and diameter controls, followed by electroplating parameter optimization. This parameter adjustment creates more favorable conditions for reliable plating compared to direct laser drilling followed by plating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances structural integrity and reduces manufacturing costs by avoiding expensive laser drilling processes, allowing for the production of small metal via structures with improved mechanical accuracy and flexibility.
Implementation Method 1
copper plating processes
Implementation Method 2
laser drilling processes
Data Source
AI summary
A packaging substrate fabrication process is provided. A substrate plate including through-plate metal via structures is provided. At least one interconnect-level structure may be formed by performing a unit sequence of processing steps that includes: a metal seed deposition step; a first masking step; a first electroplating step that forms metal lines; a second masking step; a second electroplating step that forms metal via structures; a seed layer etch step; a dielectric material deposition step that forms a dielectric material layer; and a planarization step that removes portions of the dielectric material layer that are more distal from the substrate plate than distal horizontal surfaces of the metal via structures. Laser drilling processing steps are not necessary during manufacture of the packaging substrate.