Packaging Substrate Via Plugging to Prevent RDL Misalignment
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Solution Overview
Problem
Packaging technology in the semiconductor industry does not adequately support the electrical performance of semiconductors, as it often determines the electrical connection and reliability, and the use of ceramic materials in high-end packaging substrates with through holes for improved electrical characteristics is not fully realized due to issues like misalignment and wrinkling of redistribution layers during resin impregnation.
Innovation Solution
A manufacturing method for packaging substrates involving a core layer with through-holes, filled with a via insulating portion formed by screen printing and curing, followed by a descum process to ensure flatness and adhesion, and a redistribution layer to stabilize electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through-holes are formed in ceramic substrate and conductive material is applied to improve electrical characteristics, then electrical performance is improved, but misalignment and wrinkling of redistribution layers occur during resin impregnation
Solution Approach 1:
A via insulating portion is formed in advance within the through-hole before the redistribution layer is applied. This preliminary action prevents resin from penetrating into the through-hole during impregnation, thereby preventing misalignment and wrinkling of the redistribution layer while maintaining the electrical performance benefits of the through-hole structure
Solution Approach 2:
The via insulating portion acts as an intermediary element that fills the through-hole and prevents direct contact between the resin and the through-hole cavity. This intermediary structure eliminates the harmful effect of resin penetration while preserving the electrical connection function
2Manufacturing precision
If via insulating portion is formed by screen printing and curing, then flatness and adhesion are improved, but process complexity increases
Solution Approach 1:
The via insulating portion formation process serves multiple functions simultaneously: it provides electrical insulation, maintains flatness of the surface for subsequent layer deposition, and ensures adhesion between layers. By combining multiple functions into a single process step, the overall process complexity is reduced despite the additional functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances electrical reliability and reduces misalignment of redistribution layers, enabling stable signal transmission and improved electrical performance by inhibiting defects and maintaining flatness of the insulating layer.
Implementation Method 1
a filling process of filling the through-hole with a composition for forming the via insulating portion by screen printing
Implementation Method 2
a curing process of curing the composition for forming the via insulating portion to form the via insulating portion
Implementation Method 3
a descum process of plasma-descumming the via-plugged substrate
Implementation Method 4
The filler may have an average particle diameter of 0.1 μm to less than 15 μm
Data Source
AI summary
A manufacturing method for a packaging substrate is provided. The manufacturing method includes a preparation step of preparing a base substrate including a core layer including an upper surface and a through-hole formed in a thickness direction of the core layer, a via insulating portion forming step of forming a via insulating portion in the through-hole to prepare a via-plugged substrate, and a fabrication step of fabricating a packaging substrate from the via-plugged substrate.