Packing Structure for Substrate Storing Container Vibration Isolation
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Solution Overview
Problem
Conventional packing structures for substrate storing containers fail to effectively suppress vibration transfer during transportation, which can damage sensitive semiconductor wafers.
Innovation Solution
A packing structure that includes a cuboid packing box with upper and lower cushioning materials and an elastic support member, where the lower cushioning material is not in contact with the side, front, or back plates of the box, and a rigid body supports the lower cushioning material to prevent vibration transfer, using materials like styrene foam and coil springs for absorption and support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional cushioning material is used in the packing box, then the substrate storing container is retained and some impact reduction is achieved, but vibration transfer from the bottom plate or side plate to the substrate storing container is not sufficiently suppressed
Solution Approach 1:
An elastic support member is introduced as an intermediary element between the bottom plate and the lower cushioning material. This mediator absorbs and attenuates vibration energy through its elastic deformation, preventing direct vibration transfer to the substrate storing container while maintaining structural support.
Solution Approach 2:
The elastic support member is pre-installed in the packing box before placing the substrate storing container. This prior cushioning arrangement ensures that vibration protection is already in place before any harmful vibrations can occur during transportation, allowing the system to passively absorb shocks without active control.
2Ease of operation
If the lower cushioning material is placed directly on the bottom plate, then simple support is provided, but vibration transfers directly through the cushioning material from the bottom plate to the substrate storing container
Solution Approach 1:
The elastic support member serves as a mediator positioned between the bottom plate and the lower cushioning material. It intercepts vibration waves before they reach the cushioning material, reducing the amplitude of vibrations that would otherwise be transmitted to the substrate storing container during transportation.
Solution Approach 2:
The elastic support member changes the mechanical parameters of the support system by introducing elasticity and compliance. This transforms the rigid direct contact between bottom plate and cushioning material into a compliant interface that can absorb vibration energy through elastic deformation, thereby reducing vibration transfer.
3Stability of the object's composition
If rigid support is used to hold the substrate storing container, then stable positioning is achieved, but vibration and impact are directly transmitted to the substrates
Solution Approach 1:
The system transitions from rigid support to elastic support by introducing the elastic support member. This parameter change allows the support structure to maintain positioning stability through elastic forces while simultaneously absorbing impact energy, preventing direct transmission of shocks to the fragile substrates inside the container.
Solution Approach 2:
The packing structure employs a composite approach combining the rigid bottom plate for structural integrity, the elastic support member for vibration absorption, and the cushioning material for impact mitigation. This multi-material composite system achieves both stable positioning and effective vibration reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces vibration transfer to the substrates, minimizing damage by absorbing and distributing impact and vibration effectively, ensuring stable transport of semiconductor wafers.
Implementation Method 1
an elastic support member which is disposed in the packing box, is elastically deformable, is supported by a bottom plate of the packing box, and supports the lower cushioning material
Implementation Method 2
a lower cushioning material on which the substrate storing container is placed, and which is disposed in the packing box in such a manner that the substrate storing container is sandwiched by the upper cushioning material and the lower cushioning material in a vertical direction
Data Source
AI summary
An upper cushioning material is placed on a substrate storing container in a packing box. The substrate storing container is placed on a lower cushioning material. The lower cushioning material is disposed in the packing box in such a manner that the substrate storing container is sandwiched in the vertical direction by an upper cushioning material and the lower cushioning material. Furthermore, the lower cushioning material is not in contact with any of a first side plate, a second side plate, a front plate and a back plate of the packing box, and a lower space is formed between the lower cushioning material and the first side plate, the second side plate, the front plate and the back plate of the packing box.