3D Electronic Package Assembly With Pad Alignment and Encapsulation

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Solution Overview

Problem

Existing electronic packages and manufacturing methods are inadequate, leading to excess cost, decreased reliability, and relatively low performance with large package sizes.

Innovation Solution

A method involving the use of alignment conductive pads and internal interconnects on a carrier, followed by encapsulation with substrates and interconnect coupling, which includes heat treatment and removal of carriers to achieve precise alignment and integration of electronic components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional electronic package methods are used, then manufacturing cost is reduced, but reliability decreases and performance is limited

Engineering Contradiction:

Improvepackage reliabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The electronic package is divided into multiple functional layers including substrate, encapsulant, conductive interconnects, and electronic components. Each layer is manufactured and prepared separately then assembled through precise alignment and bonding processes, allowing optimized manufacturing of each component while ensuring overall reliability

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Alignment conductive pads and internal interconnects are pre-formed on the substrate before component assembly. The encapsulant is prepared with precise alignment features in advance, enabling accurate positioning and reducing assembly complexity while improving reliability

Inventive Principle:

Principle #10Preliminary action

2Volume of moving object

If conventional package designs are used, then manufacturing simplicity is maintained, but package size becomes too large

Engineering Contradiction:

Improvepackage sizeVSAvoidpackage structure complexity

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The package design transitions from planar two-dimensional layout to three-dimensional vertical stacking. Electronic components are positioned at different heights and depths within the encapsulant, with conductive interconnects routing signals through multiple layers, dramatically reducing the footprint while increasing structural complexity

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Electronic components are nested within the encapsulant volume, with conductive interconnects routed through internal pathways. The substrate, encapsulant, and components form nested structures where smaller elements are positioned within the volume defined by larger elements, minimizing overall package size

Inventive Principle:

Principle #7Nested doll (Nesting)

3Manufacturing precision

If precise alignment is achieved through the described method, then integration quality improves, but manufacturing process complexity increases

Engineering Contradiction:

Improvealignment precisionVSAvoidmanufacturing process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

Alignment conductive pads serve as intermediary features between the substrate and electronic components. These pads provide both electrical connection and mechanical alignment references, enabling precise positioning. The encapsulant also acts as an intermediary with embedded alignment features that guide component placement and ensure accurate integration

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

Traditional mechanical alignment methods are replaced with conductive pad-based alignment and encapsulant-embedded alignment features. The alignment system transitions from purely mechanical positioning to a combined electrical-conductive-mechanical system where conductive patterns provide precise alignment references during assembly

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances the reliability and performance of electronic devices by ensuring precise alignment and integration, reducing package size, and improving manufacturing efficiency.

Implementation Method 1

coupling alignment interconnects of a connect component to the alignment conductive pads

Methodology Applied

Scientific EffectHeat treatment: Heat Treatment

Data Source

PatentUS20250385226A1Electronic devices and a methods of manufacturing electronic devices

Publication Date: 2025.12.18 AMKOR TECH SINGAPORE HLDG PTE LTD

AI summary

A method of manufacturing an electronic device may include providing alignment conductive pads and internal interconnects along an upper side of a first carrier and coupling alignment interconnects of a connect component to the alignment conductive pads. The method also includes encapsulating the connect component and the internal interconnects in a lower encapsulant, and covering an upper side of the lower encapsulant with an upper substrate. The method also includes coupling, via the upper substrate, first interconnects of a first electronic component and a second electronic component to the connect component interconnects and second interconnects of the first electronic component and the second electronic component to the internal interconnects. The method further includes removing the first carrier from a lower side of the lower encapsulant, and covering the lower side of the lower encapsulant with a lower substrate. Other examples and related electronic devices are also disclosed herein.