CMP Pad Conditioner Reverse Plating Grain Uniformity

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Solution Overview

Problem

Conventional methods for manufacturing CMP pad conditioners face challenges in uniformly distributing and supporting grains due to limitations in electrodeposition, fusing, and sintering techniques, which result in uneven surface deformation and clogged pores, affecting the uniformity of wafer polishing.

Innovation Solution

A method involving reverse plating is used to form three plating layers on a substrate, with nickel, copper, and palladium layers to create a stable and uniform support structure for grains, allowing for precise control over grain placement and stress distribution, enabling faster manufacturing and improved bonding stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional electrodeposition, fusing, or sintering techniques are used to fix grains on a conditioner support member, then grains can be attached to the support member, but the distances between grains cannot be adjusted and uniform protruding heights and portions of grains cannot be formed

Engineering Contradiction:

Improveuniformity of grain placementVSAvoidcomplexity of manufacturing process

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent applies reverse plating by inverting the support member after grain placement, allowing plating to occur on the opposite surface. This inversion technique enables precise control of grain heights and spacing by controlling plating thickness on the inverted surface, which translates to uniform grain protruding heights on the original surface, resolving the uniformity issue while maintaining process simplicity

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent performs preliminary actions by first placing grains on the support member, then inverting and plating to establish uniform heights before final assembly. The multi-step process including preliminary plating, inversion, and secondary plating ensures grain uniformity is established early in the manufacturing process, preventing subsequent variability in grain protruding heights

Inventive Principle:

Principle #10Preliminary action

2Productivity

If pressure and speed are increased during wafer polishing, then polishing efficiency is improved, but the pad surface becomes unevenly deformed and pores become clogged with residues

Engineering Contradiction:

Improvepolishing efficiencyVSAvoiduniformity of pad surface

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent applies local quality by creating a conditioner with non-uniform grain distribution and varying grain heights across different regions. The grains are strategically positioned with different protruding heights to address local pad surface defects, allowing high-speed polishing to proceed while maintaining overall pad uniformity through localized correction zones

Inventive Principle:

Principle #3Local quality

3Reliability

If a single plating layer is used to support grains, then the manufacturing process is simple, but the bonding stability and uniformity of grain support is insufficient

Engineering Contradiction:

Improvebonding stability of grainsVSAvoidnumber of plating layers

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs composite materials by using multiple plating layers with different compositions and properties. The first plating layer provides initial grain support, the second plating layer (applied after inversion) ensures uniform grain heights, and the third plating layer enhances bonding stability. This multi-layer composite structure improves grain support reliability while the systematic process keeps manufacturing complexity manageable

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for the uniform exposure of grains at a consistent height, enhancing the bonding stability and uniformity of the CMP process, thereby improving the chemical-mechanical polishing process by using compressive and tensile stresses to maintain grain positioning.

Implementation Method 1

forming a first plating layer on a temporary substrate to have multiple recesses penetrating a first boundary layer; forming a second plating layer on the second boundary layer; forming a third plating layer on an entire surface opposite to the final substrate

Methodology Applied

Scientific EffectElectroplating: Electroplating

Data Source

PatentUS11660724B2Method for manufacturing a pad conditioner by reverse plating and pad conditioner manufactured thereby

Publication Date: 2023.05.30 SAESOL DIAMOND IND

AI summary

A manufacturing method of a pad conditioner by reverse plating is disclosed. The method comprises: forming a first plating layer on a temporary substrate to have multiple recesses; forming a second adhesive photosensitive film on the first plating layer; putting grains into the recesses; forming a first filling layer to support the grains; forming a second filling layer to support the grains; removing the second adhesive photosensitive film and forming a second boundary layer on the entire surface; forming a second plating layer on the second boundary layer; removing the temporary substrate and attaching a final substrate to the second plating layer; removing the first boundary layer and the first plating layer; removing the second boundary layer excluding a portion not exposed to the outside; and forming a third plating layer on an entire surface opposite to the final substrate to support the grains.