Polishing Pad Conditioner with Variable Thickness Posture Adjusting Member
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Solution Overview
Problem
In semiconductor device manufacturing, the increasing complexity of wafer surfaces due to high integration leads to non-planarization issues during photolithography processes, causing defocus problems, which require periodic polishings to maintain surface flatness.
Innovation Solution
A pad conditioner with a rotatable disk holder, posture adjusting members, and a controller that adjusts the thickness based on sensor feedback to effectively manage the polishing pad, ensuring optimal contact and reducing surface irregularities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If periodic polishings are performed to planarize wafer surfaces, then surface flatness is improved, but device complexity and process time increase
Solution Approach 1:
The pad conditioner performs preliminary conditioning of the polishing pad before actual polishing operations. By pre-adjusting the pad's thickness and posture through the posture adjusting member and lifting and lowering mechanism, the system prepares the pad to maintain optimal contact with the wafer surface, thereby achieving better planarization results without requiring as many periodic polishings
Solution Approach 2:
The posture sensor provides real-time feedback on the pad's height and posture, and the controller adjusts the lifting and lowering support member accordingly to maintain optimal contact between the pad and wafer surface. This closed-loop control ensures consistent polishing performance and reduces the need for periodic re-conditioning
2Productivity
If the polishing pad is constantly conditioned to maintain optimal state, then polishing efficiency is improved, but device complexity increases
Solution Approach 1:
The pad conditioner integrates multiple functions into a single system: the lifting and lowering support member both adjusts pad height and maintains optimal contact pressure, while the posture adjusting member simultaneously controls pad posture and compensates for wear. This multi-functionality reduces the need for separate conditioning mechanisms
Solution Approach 2:
The pad conditioner is designed to automatically maintain the polishing pad in an optimal state through sensor feedback and automated adjustment. The system monitors pad thickness and posture continuously and self-regulates the lifting and lowering mechanism to maintain optimal polishing conditions without manual intervention
3Measurement precision
If the thickness of the posture adjusting member is varied to manage pad state, then pad contact accuracy is improved, but manufacturing precision requirements increase
Solution Approach 1:
The posture adjusting member is designed with variable thickness that can be dynamically adjusted during operation. Rather than requiring extremely precise manufacturing of a fixed thickness component, the system allows for controlled variation in thickness through the lifting and lowering mechanism, achieving accurate pad contact while accommodating normal manufacturing tolerances
Data Source
AI summary
A pad conditioner comprising: a disk holder that is rotatable; a frame on the disk holder; a lifting and lowering support member that is between the frame and the disk holder; a posture adjusting member that is between the lifting and lowering support member and the frame and has a thickness, wherein the posture adjusting member is capable of varying the thickness; a posture sensor that is configured to detect a height of the lifting and lowering support member; and a controller that is configured to vary the thickness of the posture adjusting member according to a signal received from the posture sensor.