Electronic Component Pad Convergence for Thermal Expansion

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Solution Overview

Problem

Existing electronic devices face challenges in achieving reliable electrical connections between components due to manufacturing errors and thermal expansion during the bonding process, leading to reduced connection reliability.

Innovation Solution

The electronic component features a pad region with pads arranged in specific patterns, including first and second pads with converging extension lines into distinct points, and a bonding method that involves aligning and coupling these pads with x-axis and y-axis corrections to ensure accurate alignment and thermal expansion management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional bonding process is used to connect pad regions, then manufacturing simplicity is maintained, but connection reliability deteriorates due to manufacturing errors and thermal expansion

Engineering Contradiction:
Improveconnection reliabilityVSAvoidbonding process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The pad regions are pre-designed with specific geometric configurations (converging extension lines for first pads to first point, converging extension lines for second pads to second point) before the bonding process. This preliminary design allows the pads to automatically compensate for thermal expansion and manufacturing errors during bonding, improving connection reliability without adding complex real-time correction mechanisms.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention changes the geometric parameters of the pad regions by introducing convergence points and varying between-angles. The first and second pads have different convergence points and angle variations, creating a parameter-based compensation mechanism that addresses thermal expansion and alignment errors, thereby improving reliability without significantly increasing process complexity.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If pad regions are aligned without correction, then bonding process is simple, but manufacturing precision deteriorates due to alignment errors

Engineering Contradiction:
Improvepad alignment precisionVSAvoidbonding process ease
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

Alignment marks are pre-configured in the pad regions before bonding. These marks enable automatic alignment during the bonding process, ensuring that corresponding pads from different electronic components are precisely aligned. This preliminary setup achieves high manufacturing precision without requiring complex real-time alignment corrections, maintaining ease of manufacture.

Inventive Principle:
Principle #10Preliminary action

3Stability of the object's composition

If conventional pad arrangement is used, then design simplicity is maintained, but connection stability deteriorates under thermal compression

Engineering Contradiction:
Improveconnection stabilityVSAvoidpad configuration complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The pad configurations utilize converging extension lines that meet at specific points, creating a radial or curved-like pattern rather than straight parallel arrangements. This geometric configuration allows the pads to better accommodate thermal expansion and compression forces, distributing stress more evenly and maintaining connection stability under thermal conditions without requiring overly complex structures.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the reliability of electrical connections by compensating for manufacturing errors and thermal expansion, maintaining a stable connection even after thermal compression.

Implementation Method 1

The coupling process may use a thermo-compression tool

Methodology Applied
Scientific EffectThermal compression: Thermal Expansion

Data Source

PatentEP2930557B1Electric component
Publication Date: 2018.07.04 SAMSUNG DISPLAY CO LTD
  • EP2930557B1 patent drawingFigure 1
  • EP2930557B1 patent drawingFigure 2
  • EP2930557B1 patent drawingFigure 3A~3B

AI summary

Provided is an electronic component comprising a first pad row (IPP1-110) having pads extending along corresponding extension lines (L1, L2, L3, L4) and a second pad row (IPP2-110) having pads extending along corresponding extension lines (L10, L20, L30, L40), wherein the pads of the first pad row include first pads (PG1, PG3) and second pads (PG2, PG4), wherein extension lines (L1, L3) of the first pads substantially converge to a first point (P1-1, P3-1), and extension lines (L2, L4) of the second pads substantially converge to a second point (P2-1, P4-1) different from the first point, and wherein the pads of the second pad row include third pads (PG10, PG30) and fourth pads (PG20, PG40), wherein extension lines (L10, L30) of the third pads substantially converge to a third point (P1-2, P3-2), and extension lines of the fourth pads substantially converge to a fourth point (P2-2, P4-2) different from the third point.