Polishing Pad Debris Composite for Waste-Reuse Pallets
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Solution Overview
Problem
The disposal of polishing pad debris from semiconductor manufacturing processes leads to environmental issues and material wastage, as current methods do not effectively recycle or reuse this material.
Innovation Solution
A method involving the collection of polishing pad debris from semiconductor manufacturing, combining it with wood material, and applying a force to form a composite article, which is then assembled into a pallet, thereby recycling the debris and reducing disposal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If polishing pad debris is disposed of through conventional methods, then the manufacturing process is simple, but environmental issues arise and material wastage occurs
Solution Approach 1:
The patent converts harmful polishing pad debris into a beneficial composite material by combining it with wood flour and binding agents to create reusable composite articles, thereby eliminating environmental harm while creating valuable products
Solution Approach 2:
The patent implements a recovery system where polishing pad debris is collected, processed, and transformed into composite articles for pallets and other applications, preventing disposal while recovering valuable material
2Loss of energy
If polishing pad debris is disposed of through conventional methods, then processing costs are low, but material wastage increases
Solution Approach 1:
The patent establishes a recovery process that collects polishing pad debris and transforms it into composite articles, preventing material loss while managing processing costs through efficient utilization of waste material
Solution Approach 2:
The patent creates composite materials by combining polishing pad debris with wood flour and binding agents, transforming waste into valuable composite products that reduce material wastage
3Loss of substance
If polishing pad debris is recycled into composite articles, then material wastage is reduced, but processing complexity increases
Solution Approach 1:
The patent applies parameter changes by controlling the mixing ratios of polishing pad debris, wood flour, and binding agents, along with compression pressure and temperature parameters, to transform waste material into usable composite articles through a manageable processing system
4Object-affected harmful factors
If polishing pad debris is recycled into composite articles, then environmental impact is reduced, but manufacturing time increases
Solution Approach 1:
The patent implements preliminary action by pre-mixing polishing pad debris with wood flour and binding agents, then using compression molding to rapidly form composite articles, reducing the overall manufacturing time while maintaining environmental benefits
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach recycles polishing pad debris, reducing environmental impact and material wastage by transforming it into a usable composite article for pallet construction, facilitating efficient reuse.
Implementation Method 1
rubbing over the polishing pad to remove a portion of the polishing pad and thereby produce polishing pad debris
Implementation Method 2
applying a force over the wood material and the polishing pad debris to form the composite article
Data Source
AI summary
A method of manufacturing a composite article includes providing a polishing pad; rubbing over the polishing pad to produce a polishing pad debris; collecting the polishing pad debris; providing a wood material; and applying a force over the wood material and the polishing pad debris to form the composite article, wherein the composite article includes the wood material and the polishing pad debris, and the rubbing of the polishing pad includes removing a portion of the polishing pad to produce the polishing pad debris.


