Pad Electrode Reinforcement Structure Against Insulator Microcracks
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Solution Overview
Problem
Display devices face issues with microcracks and micro displacements in the multilayer insulating structure of pad electrodes due to external forces, leading to unreliable electrical connections and potential corrosion, which affects signal and power transmission reliability.
Innovation Solution
Incorporating reinforcement patterns within the multilayer insulating structure beneath the pad electrodes to prevent microcracks and displacements, ensuring stable electrical connections and reducing exposure to cleaning solutions that cause corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multilayer insulating structure is used in the pad electrode, then electrical connection is enabled, but microcracks and micro displacements occur due to external force
Solution Approach 1:
The patent applies composite materials by combining the multilayer insulating structure with a reinforcement pattern layer. The reinforcement pattern is formed by a material having different properties from the insulating layers, creating a composite structure that provides both electrical insulation and mechanical strength. This composite approach prevents microcracks and micro displacements in the insulating structure while maintaining electrical connection reliability.
Solution Approach 2:
The reinforcement pattern is segmented into specific geometric shapes (such as grids, meshes, or patterned structures) within the multilayer insulating structure. This segmentation allows the reinforcement pattern to distribute mechanical stress across multiple points, preventing localized microcracks and displacements while maintaining the overall integrity of the pad electrode structure.
2Reliability
If the pad electrode structure is made more robust to prevent microcracks, then connection reliability improves, but device complexity increases
Solution Approach 1:
The reinforcement pattern is applied locally only in the pad electrode area where mechanical strength is needed, rather than throughout the entire display device. This localized approach provides the necessary structural robustness to prevent microcracks while minimizing the increase in overall device complexity. The reinforcement pattern is integrated into the multilayer insulating structure at specific locations where pad electrodes are positioned.
Data Source
AI summary
A display device may include a substrate including a display area and a non-display area outside the display area; a plurality of pixel driving circuits disposed on the display area of the substrate; a plurality of light-emitting elements disposed on the pixel driving circuit and electrically connected to each pixel driving circuit; a plurality of pad electrodes disposed on the non-display area of the substrate; at least one or more multilayer insulating structure disposed in a lower side of the plurality of pad electrodes; and one or more reinforcement patterns disposed between the pad electrode and the multilayer insulating structure.