Pad Gap Layout With Barrier Structure Against Solder Bridging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The miniaturization of electronic devices leads to increased bridging between electrical connectors due to shifting insulation patterns and excessive solder materials, with the sidewalls of molding trenches not being protected, causing malfunction.
Innovation Solution
The electronic device incorporates pads with indentations and a substrate design that enlarges the gap between pads, featuring a barrier structure to block the flow of reflowable conductive materials, preventing connector bridging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the gap between pads is decreased to achieve miniaturization, then the device size is reduced, but bridging between electrical connectors occurs due to shifting insulation patterns and excessive solder materials
Solution Approach 1:
The pad structure is segmented by adding indentations that divide the pad surface into multiple regions. These indentations create barriers that segment the solder material flow paths, preventing excessive solder from bridging adjacent pads while maintaining compact device dimensions.
Solution Approach 2:
The indentations are strategically positioned at specific locations on the pads where solder overflow is most likely to occur. This local modification creates enhanced barrier effects precisely where needed, improving reliability without requiring overall enlargement of the pad structure.
2Ease of manufacture
If the insulation layer pattern is shifted during manufacturing, then manufacturing complexity is reduced, but bridging occurs because the sidewalls of the molding trench are not protected
Solution Approach 1:
The indentations are formed on the pad surfaces before the insulation layer is applied. This preliminary structuring of the pad creates inherent barriers that will function regardless of subsequent insulation layer alignment variations, ensuring protection against bridging even when the insulation pattern shifts during manufacturing.
3Reliability
If excessive solder materials are used to ensure proper electrical connection, then connection reliability is improved, but bridging between adjacent pads occurs
Solution Approach 1:
The indentation geometry parameters (depth, width, spacing) are optimized to create effective barriers against solder overflow. By carefully controlling these parameters, the design allows sufficient solder material for reliable electrical connection while the indentations prevent the solder from overflowing and bridging adjacent pads.
Data Source
AI summary
An electronic device is provided. The electronic device includes a substrate, a first pad, and a second pad. The substrate defines a trench extending along a first direction. The first pad is disposed adjacent to the trench. The second pad is disposed next to the first pad. The first pad and the second pad are disposed at a same side of the trench and are arranged along the first direction. The first pad and the second pad define a first gap and a second gap therebetween along the first direction. The first gap is closer to the trench than the second gap is. A width of the first gap along the first direction is greater than a width of the second gap along the first direction.