Conductive Pad Group Design for High-Density I/O Substrates
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Solution Overview
Problem
Conventional metal pillars on substrates limit the number of input/output connections due to their structural constraints, making it difficult to increase the number of pillars and thus the interconnection capabilities.
Innovation Solution
A substrate design featuring conductive pad groups with multiple conductive pads allows for the formation of multiple metal pillars, increasing I/O connections while reducing the area occupied by conductive pads, metal pillars, and conductive traces, by strategically arranging inner and outer sides of the pads and pillars.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional metal pillars are disposed at the periphery of a substrate, then the structure is simple and easy to manufacture, but the number of I/O connections is limited
Solution Approach 1:
The conductive pad is divided into multiple segments (first conductive pad, second conductive pad, third conductive pad) arranged in a compact group. This segmentation allows multiple metal pillars to be supported within a smaller area, increasing the number of I/O connections without proportionally increasing the occupied area.
Solution Approach 2:
The conductive pads are arranged in a two-dimensional compact configuration with inner sides facing each other, transitioning from a simple linear or peripheral arrangement to a multi-dimensional compact group. This dimensional reorganization enables higher density of metal pillars within the same footprint area.
2Quantity of substance
If the number of conventional metal pillars is increased, then the number of I/O connections increases, but the area occupied by conductive pads and metal pillars increases
Solution Approach 1:
Multiple conductive pads (first, second, and third conductive pads) are merged into a single conductive pad group with shared conductive traces. This merging reduces the overall complexity compared to having separate pad structures for each metal pillar, while still supporting multiple connections.
Solution Approach 2:
The conductive pad group serves multiple functions: it provides electrical connection for multiple metal pillars, maintains mechanical stability, and enables compact routing of conductive traces. This multi-functionality reduces the need for additional separate structures, simplifying the overall device design.
Data Source
AI summary
The present disclosure provides a substrate and a semiconductor package. The substrate includes a body, at least one pad group, a plurality of traces and at least one pillar group. The pad group includes a plurality of pads. Each pad has at least one inner side and at least one outer side. The inner side of a first pad is faced to the inner side of an adjacent second pad with a spaced section between. Each pillar group includes a plurality of pillars disposed on respective ones of the pads. The use of pad groups having multiple pads on which to form pillars allows an increase in the number of the pillars available in a given area so as to increase the amount of I/O connections. Furthermore, for a given number of I/O connections, the area occupied by the pads, pillars and traces can be reduced.