Self-Assembly Pad With Hydrophobic Posts

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Solution Overview

Problem

Existing methods for self-assembly of electronic circuits face challenges in maintaining the confinement of liquid drops on pads due to insufficient wettability differences between pads and substrates, leading to errors in placement and potential drop displacement during the self-assembly process.

Innovation Solution

The method involves creating a support with nanometric or micrometric posts around the assembly pad, where the pad has a high wettability (static contact angle ≤15°) and the posts have a hydrophobic surface (static contact angle ≥150°), with specific geometric relationships between post height, width, and spacing to enhance liquid confinement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional pad manufacturing methods are used, then the manufacturing process is simple, but the wettability difference between pad and substrate is insufficient causing drop confinement failure

Engineering Contradiction:
Improvedrop confinement reliabilityVSAvoidpad structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The invention applies local quality by creating posts with hydrophobic coating only in specific locations around the pad, while the pad itself maintains high wettability. This localized differentiation of surface properties (hydrophobic posts vs. hydrophilic pad) enables reliable drop confinement without requiring complex overall structure modification

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The invention uses composite materials by combining a solid substrate with hydrophobic coating material on the posts. This composite structure (substrate + hydrophobic coating) creates the necessary wettability contrast to confine the liquid drop on the pad while maintaining structural integrity

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If pad wettability is increased to improve drop confinement, then liquid placement accuracy improves, but the difference in wettability with substrate decreases allowing drop to leave the pad

Engineering Contradiction:
Improveliquid placement precisionVSAvoiddrop confinement reliability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The invention resolves this contradiction by applying local quality - the pad surface is made highly wettable for precise liquid placement, while surrounding posts are made hydrophobic to prevent drop escape. This localized differentiation allows both high placement precision and reliable confinement to coexist

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The hydrophobic posts act as intermediary elements that mediate between the hydrophilic pad and the liquid drop. They create a energy barrier that prevents the drop from leaving the pad, allowing the pad to maintain high wettability for accurate placement while ensuring drop confinement

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly improves the confinement of liquid drops on the pads, ensuring accurate alignment and fixation of electronic circuits during self-assembly without external action, compatible with conventional electronic circuit manufacturing processes.

Implementation Method 1

The pad 14 can be made by forming a layer of silicon oxide on the substrate 12 and by etching the layer obtained to delimit the pad 14. The layer of silicon oxide can have a thickness of the order of 50 nm.

Methodology Applied
Scientific EffectWetting: Wetting

Implementation Method 2

In general, the wettability of a material can be characterized by the contact angle θ of a drop of liquid on the material. The lower the contact angle, the higher the wettability of the material.

Methodology Applied
Scientific EffectSurface tension: Surface Tension

Implementation Method 3

The forces exerted by the drop 16 on the electronic circuit 10 then move the electronic circuit 10 to the desired alignment with respect to the pad 14

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Data Source

PatentEP3535778B1Process for manufacturing assembly pads on a carrier for the self-assembly of an electronic circuit on the carrier
Publication Date: 2023.03.15 COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
  • EP3535778B1 patent drawingFigure 1A~2C
  • EP3535778B1 patent drawingFigure 3~6
  • EP3535778B1 patent drawingFigure 7~9B

AI summary

The invention relates to a process for self-assembling at least one element on a face (24) of the carrier (20) comprising at least one assembly pad (26) on said face (24), a droplet of liquid (40) having a static contact angle on the assembly pad lower than or equal to 15°, and nanoscale or micron-sized posts (28) on said face (24) around the pad (26), the droplet of liquid (40) having a static contact angle on the posts higher than or equal to 150°.