Pad Interface Circuit Gate Oxide Protection
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Solution Overview
Problem
Conventional pad interface circuits experience reduced lifespan and reliability due to higher external supply voltages affecting the gate oxide layers of transistors when the internal supply voltage is not applied, leading to degradation in performance.
Innovation Solution
A pad interface circuit incorporating a first and second stack MOS transistor with a voltage level sensing circuit that generates a feedback voltage from the pad voltage, applied to the gate terminal of the first stack MOS transistor, to control the electric field across the gate oxide layer, ensuring reliable operation even without the internal supply voltage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the pad interface circuit is designed to accept external supply voltage Ex_VDD (5V) at the pad, then the circuit can interface with external devices, but the higher voltage affects the gate oxide layer of transistors and degrades reliability
Solution Approach 1:
The patent introduces a virtual floating well as an intermediary structure between the pad interface circuit and the external voltage source. This virtual floating well acts as a mediator that isolates the gate oxide layer from the high external voltage (Ex_VDD = 5V) while still allowing the circuit to interface with external devices. The well potential floats dynamically, preventing direct voltage stress on the gate oxide layer while maintaining interface functionality.
2Use of energy by moving object
If the internal supply voltage VDD (3.3V) is not supplied to the pad interface circuit, then power consumption is reduced, but the external voltage Ex_VDD directly affects the gate oxide layer and reduces lifespan
Solution Approach 1:
The patent implements a protection mechanism that is activated beforehand when the internal supply voltage VDD is not supplied. The virtual floating well structure is pre-configured to cushion and absorb the impact of external voltage Ex_VDD before it can reach the gate oxide layer. This preemptive protection allows the circuit to operate with reduced power consumption while maintaining extended lifespan by preventing voltage-induced degradation in advance.
3Device complexity
If conventional pad interface circuit design is used, then the circuit structure is simple, but the gate oxide layer is vulnerable to external voltage and reliability is degraded
Solution Approach 1:
The patent applies local quality by creating a specialized virtual floating well structure specifically at the pad interface region where voltage stress occurs. Instead of redesigning the entire circuit, the solution locally modifies the well structure at the critical interface point. This localized approach provides enhanced protection to the gate oxide layer exactly where external voltage Ex_VDD applies stress, while keeping the rest of the circuit structure relatively simple and unchanged.
Data Source
AI summary
The pad interface circuit includes a first stack MOS transistor having a first terminal connected to a pad and a bulk connected to a first supply voltage; a second stack MOS transistor having a first terminal connected to a second terminal of the first stack MOS transistor and a second terminal, a gate terminal, and a bulk that are connected to the first supply voltage; and a voltage level sensing circuit generating a feedback voltage by using a pad voltage applied from the pad. In addition, the feedback voltage is applied to a gate terminal of the first stack MOS transistor.


