Redistribution Layer Pad Offset for Heat and EMI-Conscious Packaging
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Solution Overview
Problem
The challenge lies in efficiently establishing electrical connections between semiconductor components and component carriers, particularly due to the mismatch in pad sizes and the need for effective heat dissipation and protection against electromagnetic interference in increasingly complex and miniaturized electronic devices.
Innovation Solution
The solution involves a redistribution layer structure with second pads offset towards functional elements on the component carrier, optimizing electrical contact distribution and enhancing interaction between semiconductor elements and component carriers, allowing for efficient, reliable, and design-flexible connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional redistribution layer structure is used with aligned pads, then the electrical connection path is straightforward, but the heat dissipation efficiency is reduced and electromagnetic interference protection is compromised
Solution Approach 1:
The patent applies asymmetry by offsetting the second pads from their corresponding first pads by a predetermined distance. This asymmetric arrangement creates non-linear heat dissipation paths and improves electromagnetic interference shielding, while maintaining electrical connectivity through the redistribution layer structure.
Solution Approach 2:
The invention introduces a spatial offset dimension to the pad arrangement. Instead of aligning pads vertically (one-dimensional alignment), the second pads are positioned at a predetermined offset distance, creating a two-dimensional pad distribution pattern that enhances heat dissipation and EMI protection while maintaining electrical function.
2Reliability
If pads are offset towards functional elements, then heat dissipation and EMI protection are improved, but the electrical connection path becomes more complex
Solution Approach 1:
The patent applies local quality by differentiating the positions of first pads and second pads. The first pads are positioned at one location while the second pads are offset to another location, allowing each pad group to serve its specific function optimally - the first pads for electrical connection and the second pads for heat dissipation and EMI protection.
Solution Approach 2:
The redistribution layer structure acts as an intermediary between the first pads and second pads. It provides the electrical connection path while accommodating the offset arrangement, thereby maintaining electrical reliability despite the increased spatial complexity of the pad distribution.
3Temperature
If the offset distance between first pads and second pads is increased, then heat dissipation efficiency improves, but the electrical connection length increases causing higher resistance
Solution Approach 1:
The patent optimizes the offset distance as a critical parameter. By setting a predetermined offset distance that is neither too small nor too large, the invention achieves optimal heat dissipation efficiency while keeping the electrical connection length and resistance within acceptable limits, thereby maintaining electrical connection reliability.
Data Source
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AI summary
There is described an electronic device (100), said electronic device (100) comprising: i) a semiconductor element (110) comprising a plurality of connection pads (112) on at least one main surface (111); ii) a redistribution layer structure (120) coupled to the main surface (111) of the semiconductor element (110), wherein the redistribution layer structure (120) comprises: iia) a first main surface (121) electrically associated to the main surface (111) of the semiconductor element (110), iib) a second main surface (122) opposed to the first main surface (121), iii) a plurality of first pads (123) exposed on the first main surface (121) and electrically connected to the plurality of connection pads (112), and iv) a plurality of second pads (124) exposed at the second main surface (122); v) a component carrier (130) coupled to the redistribution layer structure (120), wherein the component carrier (100) comprises: va) at least one electrically insulating layer structure (132), and vb) at least one electrically conductive layer structure (134), wherein the at least one electrically conductive layer structure (134) is electrically connected to the plurality of second pads (124); and vi) at least one functional element (140) arranged in and/or on the component carrier (130); wherein at least some of the second pads (124) are offset in the planar view with respect to the correspondent first pads (123) towards the location of the at least one functional element (140).