Built-In Component Pad Openings for Solder Gas Venting
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Solution Overview
Problem
Conventional packages with built-in electronic components, such as FOWLPs and CSPs, face issues with pad peeling due to thermal stress and gasification of the insulating layer during soldering, leading to unreliable attachment to electronic circuit boards.
Innovation Solution
The design incorporates pads with a plurality of openings that extend from the surface in contact with solder bumps to the insulating layer, where the area of these openings on the opposite surface is smaller than on the surface in contact with the solder bumps, allowing efficient venting of gases generated during soldering, thereby reducing pressure on the pads and enhancing attachment reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stress or pressure
If conventional through holes are formed in pads, then thermal stress relief is achieved, but gas pressure from insulating layer gasification causes pad peeling
Solution Approach 1:
The pad structure implements local quality by concentrating openings at the solder bump contact surface where gas venting is most critical for preventing peeling, while maintaining a smaller opening area at the insulating layer interface to preserve adhesion. This spatial differentiation of opening distribution allows simultaneous achievement of thermal stress relief and pad attachment reliability
2Object-generated harmful factors
If the area of openings at the insulating layer surface is made equal to or larger than at the solder bump surface, then gas venting is improved, but pad attachment reliability deteriorates
Solution Approach 1:
The pad structure employs local quality by creating an asymmetric opening distribution where the opening area at the solder bump surface exceeds the opening area at the insulating layer surface. This configuration optimizes gas venting at the critical solder joint interface while preserving sufficient pad area for reliable attachment to the insulating layer, thereby simultaneously reducing gas pressure and maintaining attachment reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents pad peeling and improves attachment reliability by efficiently venting gases, reducing thermal stress, and maintaining connection integrity under thermal shock conditions.
Implementation Method 1
allowing efficient venting of gases generated during soldering, thereby reducing pressure on the pads
Implementation Method 2
a package with built-in electronic components that is to be soldered to an electronic circuit board
Implementation Method 3
an insulating layer; an electronic component provided on one surface of the insulating layer
Data Source
AI summary
A package with built-in electronic components that is to be soldered to an electronic circuit board includes: an insulating layer; an electronic component provided on one surface of the insulating layer; and a pad which is electrically connected to the electronic component and in which a plurality of openings that extend from a first surface of the pad in contact with a solder bump to the insulating layer are formed, wherein an area of the plurality of openings at the first surface is larger than an area of the plurality of openings at a second surface of the pad, which is an opposite surface to the first surface and is in contact with the insulating layer.