Pad Protection in Display Device Manufacturing
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Solution Overview
Problem
In the manufacturing of display devices, such as organic light emitting display devices, the pad part is susceptible to corrosion and bonding defects due to the exposure of signal lines when the insulating layer is removed during the patterning process, leading to potential defects in the bonding process between the integrated circuit chip and the substrate.
Innovation Solution
A method involving the formation of a semiconductor transistor on a substrate with a pixel and pad region, where a gate insulating layer, control electrode, and interlayer insulating layer are formed, followed by the creation of photosensitive film patterns to etch contact holes and form metal electrodes and pads, with specific thickness and boundary configurations to protect the interlayer insulating layer and prevent exposure of the pad part.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the insulating layer is removed during the patterning process to form the pad part, then the pad structure can be formed, but the signal line of the pad part becomes exposed and susceptible to corrosion or bonding defects
Solution Approach 1:
A second photosensitive film pattern is formed on the metal layer before etching, with its boundary line positioned to overlap with the second portion of the first photosensitive film pattern. This preliminary positioning ensures that during subsequent etching processes, the interlayer insulating layer is protected from being removed, preventing signal line exposure and corrosion while still allowing proper pad formation.
Solution Approach 2:
The boundary line of the second photosensitive film pattern serves as an intermediary protective element between the etching process and the interlayer insulating layer. By positioning this boundary line to overlap with the thicker second portion of the first photosensitive film pattern, it creates a protective zone that prevents the etchant from reaching and removing the interlayer insulating layer, thus protecting the signal line underneath.
2Ease of manufacture
If the insulating layer is completely removed to expose the pad region, then the pad can be accessed for bonding, but bonding defects may occur due to exposure of the signal line
Solution Approach 1:
The second photosensitive film pattern is preliminarily positioned with its boundary line overlapping the second portion of the first photosensitive film pattern before the etching process. This preliminary configuration ensures that during etching, the interlayer insulating layer remains protected, maintaining signal line integrity and preventing bonding defects while still allowing the pad to be properly formed and accessible for bonding operations.
3Device complexity
If a uniform thickness photosensitive film pattern is used for etching, then the manufacturing process is simpler, but the interlayer insulating layer cannot be adequately protected in the pad region
Solution Approach 1:
The first photosensitive film pattern is designed with non-uniform thickness, having a first portion with first thickness and a second portion with second thickness greater than the first thickness. The boundary line of the second photosensitive film pattern is positioned to overlap with this thicker second portion in the pad region. This local variation in thickness provides enhanced protection to the interlayer insulating layer in the pad region during etching, while maintaining simpler processing elsewhere.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the susceptibility of the pad part to corrosion and bonding defects by protecting the interlayer insulating layer, ensuring reliable connections between the integrated circuit chip and the substrate, thereby enhancing the manufacturing process and device reliability.
Implementation Method 1
forming a plurality of first contact holes exposing the semiconductor and a second contact hole exposing the first pad, wherein the plurality of first contact holes and the second contact hole are formed by etching the interlayer insulating layer using the first photosensitive film pattern as a mask
Implementation Method 2
forming an input electrode connected to the semiconductor through a first contact hole of the plurality of first contact holes, an output electrode connected to the semiconductor through a second contact hole of the plurality of first contact holes, and a second pad connected to the first pad through the second contact hole, wherein the input electrode, the output electrode, and the second pad are formed by patterning the metal layer using the second photosensitive film pattern as a mask
Data Source
AI summary
A method for manufacturing a display device, according to an exemplary embodiment of the present inventive concept, includes forming a semiconductor of a transistor on a substrate, forming a gate insulating layer on the semiconductor, forming a control electrode and a first pad on the gate insulating layer, forming an interlayer insulating layer on the control electrode and the first pad, forming a first photosensitive film on the interlayer insulating, forming a plurality of first contact holes and a second contact hole by etching the interlayer insulating layer using the first photosensitive film patterns as a mask, removing a first portion of the interlayer insulating layer, forming a metal layer on the interlayer insulating layer, forming a second photosensitive film pattern on the metal layer, forming an input electrode and an output electrode, and removing the second photosensitive film pattern and a second portion of the interlayer insulating layer.