Pad Protrusions for Wiring Board Laser Processing
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Solution Overview
Problem
The existing methods for manufacturing wiring boards face issues with thermal damage during the laser processing of electronic-component mounting pads, leading to potential separation from the underlying insulating layer and peeling off during subsequent heat treatments due to inadequate heat absorption and positional misalignment in forming openings.
Innovation Solution
Incorporating protrusion portions on the electronic-component mounting pads that protrude from the pad body into the insulating layer, providing a larger volume and enhanced adhesion, reducing thermal damage and preventing separation by increasing the contact area with the insulating layer, and forming a frame-like protrusion in the peripheral region to prevent peeling during wet treatments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a laser is used to form an opening in the insulating layer on the pad, then the opening can be precisely formed, but thermal damage accumulates in the pad due to laser heat
Solution Approach 1:
The protrusion portions are formed on the pad surface before laser opening formation. This preliminary structural modification increases the pad's heat capacity and thermal mass, allowing it to absorb laser heat without accumulating excessive thermal damage during the subsequent opening formation process.
Solution Approach 2:
The pad structure is modified by adding vertical protrusion portions that extend into the insulating layer. This three-dimensional structural change increases the pad's volume and heat absorption capacity in the vertical dimension, thereby reducing thermal damage during laser processing.
2Ease of manufacture
If the pad has a small volume, then the manufacturing process is simpler, but thermal damage is easily accumulated and the pad separates from the insulating layer during heat treatment
Solution Approach 1:
The protrusion portions are formed on the pad surface before subsequent heat treatment processes. This preliminary structural preparation ensures that when heat treatment is later applied, the increased thermal mass of the pad prevents excessive temperature rise that would cause separation from the insulating layer.
Solution Approach 2:
The pad is segmented into a pad body and multiple protrusion portions that extend into the insulating layer. This segmentation increases the contact area between the pad and insulating layer, enhancing adhesion and preventing separation during heat treatment while maintaining manufacturing feasibility.
3Adaptability or versatility
If the opening is deviated from the pad during laser process, then positioning flexibility is reduced, but wet treatment causes peeling of the pad
Solution Approach 1:
The pad is divided into a pad body and multiple protrusion portions that extend into the insulating layer. This segmentation creates a mechanical interlocking structure where the protrusion portions anchor the pad to the insulating layer, preventing peeling during wet treatment even when opening position varies.
Solution Approach 2:
The pad structure extends into the vertical dimension with protrusion portions penetrating the insulating layer. This three-dimensional configuration provides mechanical anchoring that resists peeling forces during wet treatment, offering protection regardless of horizontal opening position variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces thermal damage and enhances the adhesion of the pads to the insulating layer, preventing separation and peeling, thus improving the reliability and manufacturing accuracy of wiring boards and electronic component devices.
Implementation Method 1
in forming an opening by a laser in the insulating layer on the pad, it is possible to reduce thermal damage thermal damage which is caused by the laser and which is received by the pad
Implementation Method 2
the pad is formed on the insulating layer with a high adhesion property provided by the anchor effect
Data Source
AI summary
A wiring board includes a first wiring layer, an insulating layer, and a pad. The insulating layer is formed on the first wiring layer. The pad is formed on the insulating layer in a region where the insulating layer overlaps the first wiring layer in a plan view. The pad includes a pad body and plural protrusion portions. The protrusion portions protrude from the pad body toward a lower side of the pad body. The protrusion portions are embedded in the insulating layer. The protrusion portions are separate from the first wiring layer.