Paddle Board Probe Card for High Pin Count ATE Testing

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Solution Overview

Problem

Current flex circuits used in probe cards for ATE systems are limited by their layer count, electrical bandwidth, and mechanical dimensions, restricting signal density and pin count capabilities, which hinders high-speed and high-pin-count applications.

Innovation Solution

The use of paddle boards with printed circuit boards and right-angle connectors, which can support up to 60 layers and wider trace widths, enabling higher signal density and mechanical flexibility, and potentially incorporating active or passive circuitry for fanout of device lines, to create a more effective connection with ZIF connectors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If flex circuits are used to connect probe card to ATE system, then ease of manufacture is improved, but signal density and pin count are limited due to layer count restrictions

Engineering Contradiction:
Improveease of manufactureVSAvoidsignal density
Core Design Contradiction:
Ease of manufactureVSQuantity of substance

Solution Approach 1:

The patent transitions from a two-dimensional flex circuit layout to a three-dimensional paddle board structure with multiple rigid circuit boards stacked and connected at right angles. This dimensional change enables significantly higher layer counts (up to 60 layers) and increased signal density while maintaining manufacturing feasibility through standardized PCB fabrication processes.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If flex circuits are used for connection, then device complexity is reduced, but electrical bandwidth and mechanical dimensions are limited

Engineering Contradiction:
Improvedevice complexityVSAvoidelectrical bandwidth
Core Design Contradiction:
Device complexityVSSpeed

Solution Approach 1:

The patent employs a composite structure combining multiple rigid circuit board materials with specific dielectric properties, trace width capabilities, and mechanical characteristics. This composite approach enables higher electrical bandwidth through optimized transmission line characteristics while maintaining manageable device complexity through modular assembly.

Inventive Principle:
Principle #40Composite materials

3Ease of operation

If traditional connection methods are used, then ease of operation is maintained, but mechanical dimensions and rows of contacts are restricted

Engineering Contradiction:
Improveease of operationVSAvoidmechanical dimensions
Core Design Contradiction:
Ease of operationVSLength of moving object

Solution Approach 1:

The patent divides the connection structure into segmented rigid circuit boards arranged in a paddle board configuration, with each board section providing specific contact rows. This segmentation enables extended mechanical dimensions and increased contact rows while maintaining ease of operation through modular assembly and standardized connector interfaces.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS7459921B2Method and apparatus for a paddle board probe card
Publication Date: 2008.12.02 ADVANTEST CORP
  • US7459921B2 patent drawing
  • US7459921B2 patent drawing
  • US7459921B2 patent drawing

AI summary

A paddle board probe card for connecting a device under test with an ATE tester by means of ZIF connectors is presented. The paddle board probe card may include more than one printed circuit board mounted on a probe card in such a manner that the more than one printed circuit boards mate with ZIF connectors on an ATE testhead interface.