Paddle Chamber Baffles With Mesh Slots for Electroplating Splash Containment

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Electroplating processes in semiconductor manufacturing often result in splashing of plating fluid, leading to fluid loss, contamination, and increased downtime for cleaning, which affects the quality and consistency of metal deposition on substrates.

Innovation Solution

Incorporating baffles with multiple slots and a mesh in the electroplating system to prevent fluid splashing by obstructing fluid movement, positioned at strategic locations such as radially outward and vertically adjacent to the rotor and paddle, and attached using mounting tabs and screws.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If liquid distribution operations are performed during electroplating, then metal deposition quality is improved, but fluid loss and splashing increase

Engineering Contradiction:

Improvemetal deposition qualityVSAvoidfluid loss

Core Design Contradiction:

Manufacturing precisionVSLoss of substance

Solution Approach 1:

A baffle is introduced as an intermediary component between the liquid distribution system and the electroplating chamber environment. The baffle intercepts and redirects splashing fluid, preventing it from escaping the chamber while allowing the liquid distribution operations to continue uninterrupted, thus maintaining deposition quality without the penalty of fluid loss.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If liquid distribution operations are performed during electroplating, then metal deposition quality is improved, but contamination increases

Engineering Contradiction:

Improvemetal deposition qualityVSAvoidcontamination

Core Design Contradiction:

Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The baffle serves as a protective intermediary that contains splashing fluid within the chamber. By physically blocking the path of splashing liquid, the baffle prevents contamination of external components and maintains a clean processing environment while allowing necessary liquid distribution to occur.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Manufacturing precision

If liquid distribution operations are performed during electroplating, then metal deposition quality is improved, but cleaning downtime increases

Engineering Contradiction:

Improvemetal deposition qualityVSAvoidcleaning downtime

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The baffle is installed in advance as a protective measure against fluid splashing. By having this barrier in place before plating operations begin, the system prevents contamination and fluid loss from occurring in the first place, thereby eliminating or reducing the need for subsequent cleaning operations and associated downtime.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

4Loss of substance

If baffles are added to prevent fluid splashing, then fluid loss is reduced, but device complexity increases

Engineering Contradiction:

Improvefluid lossVSAvoidchamber structure complexity

Core Design Contradiction:

Loss of substanceVSDevice complexity

Solution Approach 1:

The baffle is designed as a segmented structure with multiple slots rather than a solid barrier. This segmentation allows the baffle to perform its fluid-blocking function while maintaining simplicity in design and fabrication. The slots provide structural openness that reduces material usage and simplifies installation compared to a fully solid baffle design.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The baffles effectively reduce or eliminate fluid splashing, maintaining additive levels and reducing downtime for cleaning, thereby ensuring consistent and high-quality metal deposition on substrates.

Implementation Method 1

The at least one baffle may be configured to limit or prevent fluid from splashing the rotor or the plating chamber during operation of the plating chamber

Methodology Applied

Scientific EffectPhysical barrier obstruction: Physical Containment

Implementation Method 2

A mesh may be positioned in each slot of the plurality of slots

Methodology Applied

Scientific EffectFiltration through mesh: Filter (physical)

Data Source

PatentUS11795566B2Paddle chamber with anti-splashing baffles

Publication Date: 2023.10.24 APPLIED MATERIALS INC

AI summary

Electroplating systems according to embodiments of the present technology may include a plating chamber configured to deposit metal material onto substrates positioned in the plating chamber. The plating chamber may include a rotor and a vessel. The electroplating systems may include at least one of baffle positioned in the plating chamber. The at least one baffle may define a plurality of slots. The at least one baffle may be configured to limit or prevent fluid from splashing the rotor or the plating chamber during operation of the plating chamber.