Multi-Stage Page Buffer Layout for Compact 3D Non-Volatile Memory

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Solution Overview

Problem

The challenge in non-volatile memory devices is the increasing demand for reduced size and improved read reliability, particularly in the page buffer circuit, which occupies a significant area in the peripheral circuit.

Innovation Solution

A non-volatile memory device with a memory cell array and a multi-stage page buffer circuit, where the page buffer is positioned vertically below the memory cell array, featuring high and low voltage regions with specific widths and arrangements to optimize space utilization and enhance read reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the page buffer circuit is designed with conventional layout, then the circuit functionality is maintained, but the area occupied by the page buffer is large

Engineering Contradiction:
Improvearea of page buffer circuitVSAvoidread reliability
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The page buffer circuit is divided into multiple stages, with each stage handling a subset of bit lines. This segmentation allows the total area to be distributed across multiple smaller units rather than requiring one large buffer, thereby reducing the area occupied by any single page buffer while maintaining overall functionality and read reliability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a conventional two-dimensional layout to a three-dimensional stacked architecture where memory cell arrays are vertically stacked above the page buffer circuit. This vertical stacking enables the page buffer to serve multiple memory layers simultaneously, reducing the area required for the page buffer while maintaining access to all memory cells across stacked layers.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Quantity of substance

If the number of stacked word lines in memory cell array is increased, then the capacity is increased, but the area of the memory cell array decreases

Engineering Contradiction:
Improvememory capacityVSAvoidarea of memory cell array
Core Design Contradiction:
Quantity of substanceVSArea of stationary object

Solution Approach 1:

The patent implements a three-dimensional stacked memory architecture where multiple memory cell arrays are vertically stacked above the page buffer circuit. This vertical stacking enables increased memory capacity by adding more word lines in the vertical dimension rather than expanding horizontally, thereby increasing capacity while reducing the planar area occupied by the memory cell array.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The page buffer circuit is designed to universally serve multiple stacked memory cell arrays simultaneously. A single page buffer can access and operate on memory cells from different stacked layers, making the page buffer multi-functional across multiple memory arrays. This reduces the need for separate page buffers for each memory layer, thereby reducing total area while maintaining increased capacity through stacking.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS12451192B2Non-volatile memory device with high voltage region and low voltage region
Publication Date: 2025.10.21 SAMSUNG ELECTRONICS CO LTD
  • US12451192B2 patent drawing
  • US12451192B2 patent drawing
  • US12451192B2 patent drawing

AI summary

Provided is a non-volatile memory device including a page buffer circuit having a multi-stage structure, wherein a stage of the multi-stage structure includes a high voltage region, a first low voltage region, and a second low voltage region. The high voltage region includes a first high voltage transistor connected to one of first to sixth bit lines and a second high voltage transistor connected to one of seventh to twelfth bit lines, the first low voltage region includes a first transistor connected to the first high voltage transistor, and the second low voltage region includes a second transistor connected to the second high voltage transistor. Each of the first low voltage region and the second low voltage regions has a first width corresponding to a pitch of six bit lines, and the high voltage region has a second width corresponding to a pitch of twelve bit lines.