Palladium-Coated Redistribution Layer for Copper Corrosion Control
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Solution Overview
Problem
The existing methods for manufacturing redistribution layers in integrated circuits face issues such as copper corrosion and oxidation during electrical testing, leading to degradation and potential delamination of the protective layers, which can cause manufacturing defects and reliability concerns.
Innovation Solution
A method involving the formation of a conductive coating layer using electroless deposition that uniformly covers both the top and lateral surfaces of a conductive body, combined with a dielectric coating, to protect the copper surface and prevent corrosion and oxidation, allowing for reliable electrical testing at higher temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrical testing is performed on copper redistribution layers, then manufacturing defects and reliability issues occur due to copper corrosion and oxidation, but skipping testing reduces manufacturing quality control
Solution Approach 1:
A dielectric coating layer is introduced as an intermediary between the copper surface and the external environment. This coating layer prevents direct contact between copper and corrosive/oxidizing agents during electrical testing, while still allowing electrical signals to pass through for testing purposes. The mediator resolves the contradiction by enabling both testing and protection simultaneously.
Solution Approach 2:
The protective coating is applied in advance before electrical testing occurs. This preliminary action prevents copper corrosion and oxidation before they can happen during the testing process. By preemptively applying the protective layer, the invention eliminates the harmful effects that would otherwise occur during necessary manufacturing testing.
2Reliability
If protective layers are applied to prevent copper corrosion, then manufacturing reliability improves, but process complexity increases
Solution Approach 1:
The invention changes the chemical and physical parameters of the copper surface by applying a dielectric coating with specific properties (insulating, adhesive, corrosion-resistant). This parameter change transforms the copper surface from vulnerable to protected, achieving reliable corrosion protection while the coating process integrates into existing manufacturing parameters.
Solution Approach 2:
The solution uses composite material structure consisting of copper interconnection layer combined with a dielectric coating layer. This composite structure leverages the electrical conductivity of copper and the protective properties of the dielectric material, achieving both functionality and protection without requiring entirely new materials or processes.
3Reliability
If uniform coating coverage is achieved on conductive bodies, then protection effectiveness increases, but manufacturing precision requirements increase
Solution Approach 1:
The conductive body is prepared in advance with specific surface characteristics that facilitate uniform coating deposition. This preliminary preparation ensures that when the protective coating is applied, it achieves uniform coverage across the entire surface, including lateral surfaces, without requiring excessive manufacturing precision during the coating process itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved protection against copper corrosion and oxidation, ensuring stable electrical connections and reduced delamination risks, enhancing manufacturing efficiency and reliability of the redistribution layer.
Implementation Method 1
forming a conductive coating layer which uniformly covers at least part of the top surface of said conductive body
Data Source
AI summary
A redistribution layer for an integrated circuit includes a conductive body in electrical contact with an interconnection layer. The conductive body has a lateral surface and a top surface. A conductive coating layer made of a material that is Palladium or includes Palladium uniformly covers the lateral surface and the top surface of said conductive body and is absent laterally to the conductive body.