Power Amplifier Module Packaging With Ceramic Sidewalls
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Solution Overview
Problem
Conventional power amplifier module packaging techniques using metal materials for all sidewalls result in high production costs and require additional processes like ceramic layer formation and etching, which are costly and complex.
Innovation Solution
A method involving a unified pattern with a ceramic layer and pattern formed on it, bonded to a metal layer, where a ceramic sidewall with external signal connection lead lines is deposited, and a metal line is formed with an insulating layer and vertical via plugs to connect the lead lines, allowing for a cost-effective and simplified packaging process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If all sidewalls of the package base are formed of metal material, then the structural strength is improved, but the production cost increases
Solution Approach 1:
The patent applies local quality by using metal material only for the base and lid portions that require high strength, while using ceramic material only for the sidewalls where insulation is needed. This localized material assignment optimizes both structural strength and production cost by avoiding unnecessary use of expensive materials in all areas.
Solution Approach 2:
The patent employs composite materials by combining metal and ceramic materials in a single package base structure. The metal base provides mechanical strength while the ceramic sidewalls provide insulation, creating a composite structure that achieves both strength requirements and cost reduction simultaneously.
2Reliability
If a ceramic layer is formed and etched on the package base for insulation, then the insulation performance is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary action by pre-forming the ceramic sidewalls as integral parts of the package base structure before subsequent assembly steps. The ceramic layer is not formed and etched as a separate post-processing step but is instead built in during the base formation process, eliminating complex etching operations and reducing manufacturing complexity.
Solution Approach 2:
The patent merges the ceramic sidewall formation with the base manufacturing process itself. Rather than treating ceramic layer formation and etching as separate complex steps, the ceramic sidewalls are integrated into the base structure from the beginning, combining multiple functions into a unified manufacturing approach that reduces overall complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and simplifies the packaging process by eliminating the need for additional ceramic layer formation and etching, while ensuring effective electrical connectivity and thermal management through the use of conductive and insulating materials.
Implementation Method 1
bonding the unified pattern on a metal layer
Implementation Method 2
depositing a ceramic sidewall, on which at least one external signal connection lead line is formed, on the unified pattern bonded the metal layer
Data Source
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Figure 2
AI summary
Disclosed is a method of packaging a power amplifier module. The method of packaging a power amplifier module includes providing a unified pattern including a ceramic layer and a pattern formed on the ceramic layer, bonding the unified pattern on a metal layer, and depositing a ceramic sidewall, on which at least one external signal connection lead line is formed, on the unified pattern bonded the metal layer.