Panel Alignment Mark and Dummy Pads for Precise Display Bonding
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Solution Overview
Problem
Existing display devices face challenges in accurately aligning the connection circuit board with the display panel, leading to potential defects such as lift defects and air bubbles during the bonding process.
Innovation Solution
Incorporating a panel alignment mark on the display panel and using dummy pads on the connection circuit board that overlap the alignment mark, allowing for precise alignment and reduced restoration force, thereby minimizing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a panel alignment mark is added to improve alignment accuracy, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent uses dummy pads as simplified copies or representations of actual connection pads. These dummy pads replicate the positioning function of real pads without requiring full electrical connection structures, thereby reducing manufacturing complexity while maintaining alignment accuracy through the alignment mark system.
2Manufacturing precision
If dummy pads are used to overlap the alignment mark for precise positioning, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent extracts the alignment function from the complete pad structure, separating positioning responsibilities from electrical connection functions. The dummy pads serve solely as alignment references overlapping the panel alignment mark, while actual connection pads handle electrical connections, thereby improving alignment precision without unnecessarily complicating the overall device structure.
3Reliability
If the connection circuit board is bonded tightly to reduce defects, then reliability is improved, but air bubbles and lift defects occur during bonding
Solution Approach 1:
The patent implements preliminary alignment actions using the panel alignment mark and dummy pads before the actual bonding process. By pre-positioning the connection circuit board accurately relative to the display panel through the alignment mark system, the bonding process can proceed with proper spacing control, preventing air bubbles and lift defects while ensuring reliable bonding quality.
Data Source
AI summary
A display device includes a display panel including a plurality of panel pads, and a panel alignment mark adjacent to the plurality of panel pads. A connection circuit board is connected to the display panel. The connection circuit board includes a plurality of input/output pads and a plurality of dummy pads adjacent to the plurality of input/output pads. Some of the plurality of dummy pads overlap the panel alignment mark in a thickness direction of the display device.