Semiconductor Panel Architecture for Stronger Electrostatic Chucking
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Solution Overview
Problem
The use of larger semiconductor panels in panel-level packaging is hindered by physical constraints such as panel warpage and the handling limitations of processing tools, particularly due to the degradation of electrostatic chucks' holding ability by thick panels with low-k cores and increased active layers, leading to low yields and manufacturing challenges.
Innovation Solution
Incorporating electrically isolated metal structures with through-thickness elements into semiconductor panels to enhance the electrostatic chucking force, reducing sensitivity to substrate design and improving handling capabilities by localizing polarization effects and distributing these structures uniformly across the panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If larger semiconductor panels are used in panel-level packaging, then area utilization ratio and production cost efficiency are improved, but handling capability and processing control are degraded due to panel warpage and tool limitations
Solution Approach 1:
The patent changes the electrical parameters of the panel by incorporating conductive structures (through-holes filled with conductive material) to modify the electrostatic properties. This allows the panel to interact more effectively with the electrostatic chuck, improving holding force without changing the physical size of the panel, thus resolving the contradiction between large panel usage and handling capability
Solution Approach 2:
The conductive through-holes act as intermediaries between the electrostatic chuck and the panel substrate. These structures facilitate the transmission of electrostatic force through the panel thickness, enabling better coupling between the chuck and the panel, thereby improving handling capability while maintaining large panel dimensions
2Adaptability or versatility
If thick panels with low-k cores and greater numbers of active layers are used, then functionality and integration are improved, but electrostatic chucking force is degraded
Solution Approach 1:
The patent addresses the thickness issue by extending conductive structures through the entire thickness of the panel (through-holes). This three-dimensional approach creates direct electrostatic pathways from the front surface to the back surface, enabling the electrostatic chuck to exert holding force effectively through the thick panel structure, thus resolving the contradiction between panel thickness and chucking force
Solution Approach 2:
The patent uses composite construction by filling through-holes with conductive material (such as metal) while maintaining the low-k dielectric core structure. This composite approach allows the panel to retain its low-k properties for functionality while the conductive fillers provide electrostatic coupling pathways, resolving the contradiction between functionality and electrostatic chucking force
3Force
If electrically isolated metal structures with through-thickness elements are added to enhance electrostatic chucking, then electrostatic chucking force and handling capability are improved, but substrate design complexity increases
Solution Approach 1:
The conductive through-holes serve multiple functions: they provide electrostatic coupling for chucking, act as mechanical support structures, and can be integrated with existing vias and interconnect structures in the panel. This multi-functionality reduces the need for additional separate structures, thereby limiting the increase in substrate design complexity while still achieving improved electrostatic chucking force
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the electrostatic chucking force, improves handling capabilities, and increases manufacturing yields, especially for thicker glass-core panels, by reducing the sensitivity to substrate design and allowing for more efficient panel-level processing.
Implementation Method 1
an electrostatic chuck configured to carry an electrostatic charge for producing an electrostatic force at its top surface
Implementation Method 2
producing an electrostatic force at its top surface to hold a semiconductor panel thereon
Implementation Method 3
activating the electrostatic chuck to induce polarization at the top surface that is greater at the positions with the plurality of electrically isolated structures
Data Source
AI summary
The present disclosure is directed to a semiconductor panel providing a laminated structure and a plurality of electrically isolated structures distributed throughout the laminated structure to increase an attraction between the laminated structure and an electrostatic chuck. In an aspect, the electrically isolated structures are positioned in spaces in the semiconductor panel without electrically active devices and interconnects. In yet another aspect, the present method provides a semiconductor panel and forming a plurality of electrically isolated structures in selected positions on the semiconductor panel and an electrostatic chuck configured to carry an electrostatic charge for producing an electrostatic force at its top surface, placing the semiconductor panel on the electrostatic chuck, and activating the electrostatic chuck to induce polarization at the top surface to produce an attractive force having a greater magnitude at the positions with the plurality of electrically isolated structures.