Display Panel Bonding Alignment Using Sensor-Guided Board Contact
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Solution Overview
Problem
Existing bonding technologies face challenges in accurately aligning circuit boards on the side surfaces of display panels, leading to inefficiencies and increased defective rates in display device manufacturing.
Innovation Solution
A bonding device is developed, featuring a stage with a sensor and a handler equipped with a rod that selectively contacts the circuit board, allowing for precise alignment between the display panel's pads and the circuit board's connection pads, utilizing a camera for accurate positioning and a bonding head for secure attachment using thermal-compression, ultrasonic, or laser methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional bonding methods are used, then the bonding process can be completed, but the alignment accuracy between the circuit board and display panel is insufficient
Solution Approach 1:
The patent replaces conventional mechanical alignment methods with a sensor-based detection system. The sensor detects the position of the circuit board relative to the display panel and provides feedback for precise alignment, substituting manual or coarse mechanical positioning with automated optical/electrical detection to achieve higher alignment accuracy and reduce defects.
Solution Approach 2:
The patent introduces a sensor as an intermediary between the circuit board and display panel alignment process. The sensor acts as a mediator that detects positional information and enables precise alignment without direct mechanical contact or manual intervention, resolving the contradiction between alignment accuracy and defective rate.
2Manufacturing precision
If the rod is continuously in contact with the circuit board, then alignment control is maintained, but the risk of damaging the circuit board increases
Solution Approach 1:
The patent applies dynamic control to the rod-circuit board interaction. The rod is selectively engaged or disengaged from the circuit board based on alignment requirements, rather than maintaining continuous contact. This dynamic approach allows alignment control when needed while minimizing damage risk during other operations.
Solution Approach 2:
The patent uses partial contact through the rod rather than full continuous contact. The rod provides alignment control only when selectively engaged, applying the minimum necessary action to achieve alignment without excessive force or prolonged contact that could damage the circuit board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables more accurate alignment and bonding of circuit boards to display panels, reducing the defective rate and minimizing bezel area, thereby enhancing the manufacturing efficiency and quality of display devices.
Implementation Method 1
a sensor disposed on the stage and facing the first area
Implementation Method 2
a camera disposed on the stage
Implementation Method 3
bonding head for secure attachment using thermal-compression, ultrasonic, or laser methods
Implementation Method 4
bonding head for secure attachment using thermal-compression, ultrasonic, or laser methods
Implementation Method 5
bonding head for secure attachment using thermal-compression, ultrasonic, or laser methods
Data Source
AI summary
A bonding device includes a stage supporting a display panel including a first area through which a pad is exposed, a sensor disposed on the stage and facing the first area, and a handler disposing a circuit board on the first area. The handler includes a body supporting the circuit board and a rod connected to the body and selectively in contact with a second area of the circuit board overlapping the first area.