Panel Bonding Pre-treatment for Segmentation Peeling
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Solution Overview
Problem
The existing manufacturing processes for display panels often result in damage during the segmentation process, leading to reduced manufacturing yield and increased costs due to structural peeling issues.
Innovation Solution
A pre-treatment method is applied to the first bonding component within the motherboard, transforming a part of the bonding portion into a fractureable transformation portion through processes like laser or infrared heating, allowing for easier separation and reducing structural peeling during the segmentation process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional bonding component is used during segmentation, then strong bonding strength is maintained, but structural peeling occurs and manufacturing yield decreases
Solution Approach 1:
The bonding component is divided into two distinct regions: a first bonding portion with strong bonding characteristics and a second bonding portion with weak bonding characteristics. This segmentation allows the weak bonding portion to be easily fractured during segmentation, preventing structural peeling, while the strong bonding portion maintains reliable bonding. This directly resolves the contradiction by enabling both high bonding strength and high manufacturing yield through spatial division of bonding functions.
Solution Approach 2:
Different regions of the bonding component are assigned different bonding strengths: the first bonding portion has strong bonding characteristics to maintain reliability, while the second bonding portion has weak bonding characteristics to facilitate clean separation during segmentation. This local differentiation of bonding properties eliminates structural peeling and improves manufacturing yield without sacrificing overall bonding strength.
2Ease of manufacture
If uniform bonding component is used, then manufacturing process is simple, but segmentation causes structural peeling and damage
Solution Approach 1:
The bonding component is segmented into a first bonding portion and a second bonding portion with different properties. The first bonding portion provides strong bonding for structural integrity, while the second bonding portion is designed to fracture easily during segmentation. This segmentation approach maintains structural integrity while enabling clean separation, resolving the contradiction between process simplicity and structural reliability.
Solution Approach 2:
The bonding component is pre-designed with a weak bonding portion that is intended to fracture during the segmentation process. This preliminary design of the bonding component's structure ensures that when segmentation occurs, the weak portion breaks first, preventing structural peeling and damage to the panel, thus maintaining structural integrity while following a relatively simple manufacturing process.
3Stability of the object's composition
If bonding component is designed for strong bonding, then panel stability is improved, but segmentation difficulty increases and damage occurs
Solution Approach 1:
The bonding component is divided into a first bonding portion with strong bonding characteristics that ensures panel stability, and a second bonding portion with weak bonding characteristics that enables easy segmentation. The strong first bonding portion maintains panel stability during operation, while the weak second bonding portion allows for easy and damage-free segmentation, resolving the contradiction between stability and segmentation ease.
Solution Approach 2:
Different regions of the bonding component have different bonding strengths tailored to their specific functions. The first bonding portion has strong bonding properties to ensure panel stability, while the second bonding portion has weak bonding properties to facilitate easy segmentation. This local quality differentiation resolves the contradiction by providing strong bonding where needed for stability while enabling easy separation where needed for manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The pre-treatment method effectively reduces the likelihood of structural peeling and enhances the reliability and stability of the panel separation, improving the overall manufacturing efficiency and yield.
Implementation Method 1
the pre-treatment includes a laser heating process
Implementation Method 2
the pre-treatment includes a high-frequency induction heating process
Implementation Method 3
the pre-treatment includes an infrared heating process
Implementation Method 4
cracking (e.g., thermal cracking) or charring occurs in the first transformation portion
Data Source
AI summary
A method for manufacturing a panel includes at least one step as below. A pre-treatment is performed on a first bonding component between two substrates, so that a part of a first bonding portion of the first bonding component becomes a first transformation portion, in which at least one characteristic of the first bonding portion is different from that of the first transformation portion.