Panel Substrate Bridge Patterns for Sagging-Resistant Module Transfer
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Solution Overview
Problem
Existing display devices face challenges in achieving a single-layer protective layer that provides comprehensive protection against external impacts and heat dissipation while maintaining structural integrity and reliability.
Innovation Solution
A panel substrate with a protective layer comprising a plurality of main parts and bridge patterns is designed, where the bridge patterns connect adjacent main parts, enhancing tensile force and reducing sagging during transfer, and is manufactured using a single-layer resin composition applied through screen-printing or slit-coating processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single-layer protective layer is used instead of multiple functional layers, then device complexity is reduced and manufacturing is simplified, but reliability and comprehensive protection capability may be compromised
Solution Approach 1:
The protective layer is segmented into multiple discrete protective patterns (first protective patterns, second protective patterns, third protective patterns) with different material compositions and functions. Each pattern targets specific protection needs: impact resistance, heat dissipation, or chemical resistance, allowing a single-layer structure to deliver multi-functional protection without requiring multiple stacked layers.
Solution Approach 2:
Different regions of the protective layer are assigned different material properties and thicknesses based on local requirements. The first protective patterns use materials optimized for impact resistance in high-stress areas, while second and third protective patterns provide heat dissipation and chemical resistance in specific zones. This localized optimization enables comprehensive protection within a single layer.
2Ease of manufacture
If the protective layer is made as a single continuous layer, then manufacturing is simplified, but sagging and deformation occur during transfer processes
Solution Approach 1:
The protective layer is divided into multiple discrete protective patterns rather than a continuous layer. This segmentation reduces the overall flexibility and sagging tendency while maintaining ease of manufacture through pattern-based fabrication processes. The discrete patterns are less prone to deformation during transfer while still providing comprehensive coverage.
Solution Approach 2:
The protective patterns extend in multiple directional orientations (first direction, second direction, third direction) across the substrate. This multi-dimensional arrangement distributes mechanical stress and reduces sagging in any single direction while maintaining manufacturing simplicity through systematic pattern replication.
3Reliability
If multiple functional layers are stacked to provide comprehensive protection, then reliability and protection capability are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
Multiple protective functions that would traditionally require separate stacked layers are merged into a single protective layer containing multiple protective patterns. The first, second, and third protective patterns with different material compositions are integrated in the same layer, eliminating the need for multiple stacking operations while maintaining comprehensive protection capabilities.
Solution Approach 2:
The single protective layer achieves multi-functionality by incorporating protective patterns with different material properties tailored for specific protection needs. The first protective patterns provide impact resistance, second patterns provide heat dissipation, and third patterns provide chemical resistance, allowing one layer to perform multiple protective functions simultaneously.
Data Source
AI summary
A panel substrate includes a mother substrate having a plurality of cell regions and a peripheral region surrounding the plurality of cell regions. A protective layer is disposed under the mother substrate. The protective layer includes a plurality of main parts overlapping the plurality of cell regions, and a plurality of bridge patterns overlapping the peripheral region. The plurality of bridge patterns connecting main parts adjacent to each other among the plurality of main parts.