Vertical Die Transfer Layout for Accurate Panel-Level Bonding
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Solution Overview
Problem
Panel level packaging of semiconductor devices faces challenges such as dust management, low throughput, and inefficiencies in die bonding processes, including long wafer changeover times and inaccuracies in die placement, which hinder the overall efficiency and effectiveness of the process.
Innovation Solution
A die bonding apparatus and method that includes a carrier support unit, a wafer feed unit, and a die transfer module, allowing for vertical orientation of the carrier panel and diced wafer, reduced travel distance for dies, and integrated vision systems for real-time inspection and feedback, enabling efficient die placement and bonding with reduced dust accumulation and increased throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional wafer level packaging is used, then dust management is easier, but packaging volume and throughput are limited
Solution Approach 1:
The patent transitions from horizontal wafer placement to vertical wafer orientation, changing the dimensional arrangement of the packaging process. The wafer is held vertically with its surface facing the carrier panel, allowing gravity to prevent dust accumulation while enabling higher packaging density and throughput in the panel level packaging process
2Productivity
If panel level packaging is used, then packaging throughput increases, but wafer changeover time increases
Solution Approach 1:
The patent employs a dynamically adjustable wafer holder that can change the orientation and position of the wafer during the packaging process. The wafer holder can tilt and reposition the wafer to optimize bonding operations and facilitate rapid changeover between different wafers, reducing idle time while maintaining high packaging throughput
3Productivity
If panel level packaging is used, then packaging volume increases, but die placement accuracy decreases
Solution Approach 1:
The patent incorporates a vision system that provides real-time feedback on die placement accuracy. The vision system captures images of the wafer and carrier panel, processes the data to detect positioning deviations, and provides feedback signals to adjust the die transfer and placement mechanisms, ensuring high placement accuracy even when packaging large volumes of dies on panel-level substrates
Data Source
AI summary
A die bonding apparatus having: a carrier support unit having at least one support element defining a supporting plane and a carrier holder operable to support the carrier panel on a side of the supporting plane with the carrier panel being parallel to the supporting plane, a wafer feed unit having a wafer holder operable to hold a diced wafer in a manner so as to space the diced wafer apart from the supporting plane defined by the at least one support element of the carrier support unit and orient the diced wafer with an exposed surface of the diced wafer facing the side of the supporting plane to which the carrier panel is supported, and a die transfer module disposed between the carrier support unit and the wafer feed unit, the die transfer module operable to transfer a die from the diced wafer to the carrier panel.