Panel Encapsulation Thickness Feedback Between Deposition Chambers
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Solution Overview
Problem
Existing methods for manufacturing display panels struggle with accurate and timely measurement of the thickness of thin film encapsulation layers, particularly the first inorganic layer, which affects the protection of light-emitting elements from foreign substances.
Innovation Solution
An apparatus and method that includes a layer thickness measuring device integrated between process chambers to measure the thickness of the first inorganic layer immediately after deposition, allowing for real-time adjustment of the deposition amount to achieve the target thickness, followed by the sequential deposition of an organic and second inorganic layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If thickness measurement is performed after the thin film encapsulation layer is fully formed, then all layers are protected and complete, but the measurement cannot be used to adjust the first inorganic layer deposition amount
Solution Approach 1:
The thickness measuring device performs measurement of the first inorganic layer immediately after its deposition, before subsequent layers are formed. This preliminary measurement enables real-time feedback to adjust the deposition amount of the first inorganic layer, achieving precise thickness control without delaying the overall process.
2Measurement precision
If the thickness measuring device is integrated between process chambers, then real-time measurement is enabled, but the device complexity increases
Solution Approach 1:
The thickness measuring device is integrated into the manufacturing apparatus by positioning it between the first and second process chambers. This merging of measurement functionality with the existing deposition and processing chambers enables continuous, real-time thickness monitoring without requiring separate standalone measurement equipment, thus achieving measurement precision while managing overall system complexity.
3Manufacturing precision
If deposition amount is controlled based on post-measurement data, then thickness accuracy is improved, but additional processing cycles are required
Solution Approach 1:
The system implements a feedback mechanism where the thickness measuring device measures the first inorganic layer thickness, and this measurement data is used to control and adjust the deposition amount for subsequent first inorganic layers. This real-time feedback loop ensures high thickness precision while maintaining manufacturing efficiency by preventing the need for additional corrective processing cycles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures precise control of the thin film encapsulation layer thickness, enhancing the protection of light-emitting elements and improving the manufacturing process efficiency by reducing the need for post-deposition thickness adjustments.
Implementation Method 1
a first process chamber in which a first inorganic layer is deposited on a substrate to cover a display element layer disposed on the substrate
Implementation Method 2
An ellipsometer may be used as the layer thickness measuring device. The ellipsometer may measure optical characteristics such as a thickness and refractive index of a thin film by utilizing polarization properties of light.
Data Source
AI summary
An apparatus for manufacturing a panel includes a first process chamber in which a first inorganic layer is deposited on a substrate to cover a display element layer disposed on the substrate, a second process chamber which receives the substrate, on which the first inorganic layer is deposited, so that an organic layer is printed on the first inorganic layer, a third process chamber which receives the substrate, on which the organic layer is printed, so that a second inorganic layer is deposited on the organic layer, and a layer thickness measuring device disposed between the first process chamber and the second process chamber to measure a thickness of the first inorganic layer when the substrate is transferred from the first process chamber to the second process chamber.