Panel Lamination with Integrated Encapsulation Glue Cutting
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Solution Overview
Problem
Existing lamination processes require additional cutting steps to trim the overhanging encapsulation glue layer, increasing process time and risking damage to the panel.
Innovation Solution
A lamination apparatus and method that integrates a cutting knife within the lamination process, allowing simultaneous cutting and lamination of the encapsulation glue layer, using a movable upper mold with an encapsulation glue fixing part and a cutting knife positioned between the lamination area and the glue fixing part, with optional buffer members to support the panel and glue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a separate cutting machine is used to cut the peripheral area of the encapsulation glue layer, then the encapsulation glue layer can be trimmed, but the overall process time increases
Solution Approach 1:
The patent combines the cutting function and lamination function into a single integrated apparatus. The cutting knife is positioned within the lamination apparatus to cut the encapsulation glue layer during the lamination process, eliminating the need for a separate cutting machine and reducing overall process time.
Solution Approach 2:
The lamination apparatus is designed with multi-functionality by incorporating both lamination and cutting capabilities. The upper mold serves both as a pressing element for lamination and as a support structure that positions the cutting knife, allowing one device to perform multiple operations.
2Manufacturing precision
If a cutting machine is used to cut the peripheral area of the encapsulation glue layer, then the encapsulation glue layer can be trimmed, but the panel may be damaged during the process
Solution Approach 1:
The patent introduces buffer members as intermediary elements between the cutting knife and the panel. These buffer members provide support to the panel during the cutting process, distributing the mechanical stress and preventing direct contact between the cutting knife and the panel, thereby avoiding panel damage.
Solution Approach 2:
The buffer members are positioned in advance to provide cushioning support before the cutting operation begins. This pre-positioned support system ensures that when the cutting knife operates, the panel is already protected from potential damage through the cushioning effect of the buffer members.
3Manufacturing precision
If the encapsulation glue layer area extends beyond the panel perimeter, then complete coverage is achieved, but additional cutting steps are required
Solution Approach 1:
The patent merges the cutting operation with the lamination operation by positioning the cutting knife within the lamination apparatus. This allows the encapsulation glue layer to extend beyond the panel perimeter for complete coverage while eliminating the need for separate cutting steps, as both operations are performed in one integrated process.
Data Source
AI summary
A lamination apparatus is adapted to laminate an encapsulation glue and a panel. The lamination apparatus includes a lower mold, an upper mold, and a cutting knife. The lower mold has a lamination area and a peripheral area adjacent to the lamination area. The panel is adapted to be retained in the lamination area. The upper mold is movable close to or away from the lower mold, and includes an encapsulation glue fixing part. The encapsulation glue fixing part is adapted to fix the encapsulation glue to the upper mold. The cutting knife is disposed in the peripheral area of the lower mold, and is located in a horizontal direction between the lamination area of the lower mold and the encapsulation glue fixing part of the upper mold. In addition, a lamination method is also disclosed.