Panel-Molded Electronic Assemblies for Thermal Management
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Solution Overview
Problem
Current encapsulated electronic power converters face challenges in achieving high power density while minimizing mounting area and cost, with existing methods struggling to efficiently manage heat and optimize component placement on printed circuit boards.
Innovation Solution
A method involving a panel molding process where a printed circuit board with components is encapsulated between heat sink panels, using molding compound to form integral structural layers, and then singulated to expose electrical contacts, allowing for efficient heat dissipation and reduced material usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If encapsulation is used to protect electronic components, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process segments the encapsulation operation by providing multiple mold panels that can be independently assembled and disassembled. Each mold panel can be configured for specific component layouts, allowing the complex encapsulation task to be divided into manageable segments that are easier to manufacture and maintain.
Solution Approach 2:
The mold panels are designed with universal features that allow them to accommodate different electronic component configurations. The same basic mold panel structure can be reused for various product types by reconfiguring the internal chamber, reducing the need for entirely different manufacturing equipment for each application.
2Productivity
If power density is increased, then productivity is improved, but heat management becomes more difficult
Solution Approach 1:
The mold panels are merged with heat sink functionality, combining the encapsulation structure with thermal management in a single integrated component. The panels conduct heat away from the electronic components while simultaneously providing the molding cavity, thus improving heat dissipation without adding separate thermal management equipment.
Solution Approach 2:
The encapsulant material serves as an intermediary that facilitates heat transfer from the electronic components to the mold panels. By selecting encapsulant materials with appropriate thermal conductivity, heat is efficiently conducted from the power-dense components through the encapsulant to the heat-sink panels.
3Productivity
If mounting area is decreased, then productivity is improved, but manufacturing precision requirements increase
Solution Approach 1:
Multiple components are arranged and pre-positioned on the substrate within the mold cavity before the encapsulation process begins. This preliminary arrangement allows for precise component placement to be achieved during the molding operation itself, rather than requiring separate, highly precise placement steps, thus reducing overall manufacturing precision requirements while maintaining compact mounting area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of high-power density electronic modules with improved thermal management and reduced costs by optimizing component placement and minimizing material waste, while allowing for efficient electrical connections.
Implementation Method 1
Encapsulation in this manner may aid in conducting heat out of the over-molded components
Implementation Method 2
curing the encapsulant
Data Source
AI summary
A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector. Reuseable plates may be used instead of the heat sink panels. Alternatively the panel may be encapsulated in and separated from a re-useable mold after curing.