Panel-Level Package Testing Without Repeated Burn-In Heating
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Solution Overview
Problem
Current semiconductor package testing methods, particularly for panel level packages, face inefficiencies due to the need for repeated heating of burn-in boards, leading to increased costs and prolonged testing times, as well as the complexity of handling and testing individual devices post-singulation.
Innovation Solution
A method and apparatus for testing semiconductor devices in a panel level package (PLP) that allows simultaneous or sequential functional testing under various conditions without the need for burn-in boards, utilizing a PLP structure where devices are tested in a matrix format, reducing the need for repeated heating and simplifying the testing process by using a single apparatus for both burn-in and functional testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If burn-in boards are used for functional testing of PLP devices, then testing can be performed under various conditions, but repeated heating of the burn-in boards increases testing time and costs
Solution Approach 1:
The patent combines the burn-in function and functional testing function into a single integrated apparatus. The heating unit heats the PLP substrate directly, while the contactor simultaneously contacts the terminals to perform functional testing, eliminating the need for separate burn-in boards and repeated heating cycles.
Solution Approach 2:
The testing apparatus is designed to perform multiple functions: heating the PLP substrate to various temperatures and simultaneously performing functional tests on multiple devices. This multi-functional design eliminates the need for dedicated burn-in boards and allows continuous testing without repeated heating.
2Reliability
If burn-in boards are used for functional testing, then testing can be performed, but frequent replacement of burn-in boards increases costs
Solution Approach 1:
The patent integrates the heating function and testing function into a single apparatus, eliminating the need for separate burn-in boards that require frequent replacement. This reduces manufacturing costs while maintaining testing reliability through direct heating and simultaneous testing.
3Reliability
If individual devices are handled after singulation for testing, then functional testing can be performed, but handling and testing complexity increases
Solution Approach 1:
The patent performs functional testing on multiple devices simultaneously while they remain mounted on the PLP substrate. The contactor contacts multiple terminals at once, and the heating unit heats all devices uniformly, eliminating the need for individual handling and reducing testing complexity.
Solution Approach 2:
The patent transitions from individual device testing to panel-level testing by arranging multiple devices in a matrix on the substrate. This dimensional approach allows simultaneous testing of multiple devices, reducing handling complexity while maintaining testing reliability.
4Adaptability or versatility
If repeated heating of burn-in boards is performed, then functional testing under various conditions is achieved, but testing costs increase
Solution Approach 1:
The patent combines heating and functional testing into a single integrated process. The heating unit heats the PLP substrate to various temperatures while the contactor simultaneously performs functional tests, eliminating the need for repeated heating of separate burn-in boards and reducing testing costs.
Data Source
AI summary
Provided is a test method including: placing, on a placement unit, a panel level package in which a plurality of unsingulated devices are formed in a matrix; bringing a plurality of contacts electrically connected to a plurality of terminals of a test circuit into contact with a plurality of contact terminals provided on one side in the panel level package in a row direction of the matrix and connected via a plurality of lead-out wirings to an internal circuit of each device in each row of the plurality of devices, respectively; and testing, by the test circuit, each device in the each row electrically connected via the plurality of contacts.