Panel-Level Package Testing for Unsingulated Semiconductor Devices
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Solution Overview
Problem
Current semiconductor package manufacturing methods are inefficient in testing and processing large panels of unsingulated devices, leading to increased costs and prolonged testing times due to the need for repeated use of burn-in boards and separate testing of each device.
Innovation Solution
A method involving a panel-level package (PLP) where multiple unsingulated devices are tested and processed as a matrix, using a single apparatus for both burn-in and functional testing, eliminating the need for individual device handling and reducing the frequency of apparatus replacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If individual device testing is performed using separate burn-in boards, then testing accuracy is maintained, but testing time increases and productivity decreases
Solution Approach 1:
The patent combines multiple individual device testing operations into a single panel-level testing operation. Multiple unsingulated devices are tested simultaneously on one panel rather than individually on separate burn-in boards, merging multiple testing functions into one unified process that maintains accuracy while improving throughput.
Solution Approach 2:
The testing apparatus is designed to perform multiple functions: it can test multiple devices simultaneously, perform both burn-in and functional testing, and handle panel-level devices without requiring separate specialized equipment for each function, thereby improving productivity while maintaining testing precision.
2Adaptability or versatility
If frequent apparatus replacement is performed for testing different devices, then testing flexibility is maintained, but testing time increases and productivity decreases
Solution Approach 1:
The testing apparatus is designed with universal capabilities to handle multiple device types and testing functions without requiring replacement. A single apparatus performs burn-in testing, functional testing, and can accommodate panel-level devices, eliminating the need for frequent apparatus changes while maintaining flexibility.
Solution Approach 2:
The apparatus is pre-configured with multiple contactors and test circuits that can be selectively activated for different testing scenarios. This preliminary preparation allows the system to adapt to different testing needs without physical apparatus replacement, reducing downtime while maintaining versatility.
3Productivity
If panel-level package structure is used, then productivity improves through simultaneous testing, but device complexity increases
Solution Approach 1:
The panel-level package is divided into multiple independent device regions, each with its own contactor and test circuit. This segmentation allows simultaneous testing of multiple devices while maintaining manageable complexity through modular organization of test signals and contactors.
Solution Approach 2:
The invention transitions from one-dimensional individual device testing to two-dimensional panel-level testing. Multiple devices are arranged in a panel matrix and tested simultaneously across the panel surface, adding a spatial dimension to the testing process that improves productivity while the contactor design manages the increased complexity.
Data Source
AI summary
Provided is a test method including: placing, on a placement unit, a panel level package formed with a plurality of unsingulated devices; bringing at least one contact electrically connected to at least one terminal of a test circuit into contact with at least one terminal of at least one device of the plurality of devices, respectively, the terminal being exposed on a second surface on a side opposite to a first surface on the placement unit side in the panel level package; and testing, by the test circuit, the at least one device electrically connected via the at least one contact.