Double-Sided Panel-Level Packaging to Prevent Warping
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Solution Overview
Problem
Current panel-level fan-out package technologies with single-sided designs face issues of uneven stress distribution, leading to warping and reduced preparation efficiency, which increases costs and compromises the integration of high-density micro-electronic components in electronic products.
Innovation Solution
A panel-level package structure with a double-sided symmetrical design featuring a bonding layer connecting two temporary carriers, forming a closed or non-closed bonding cavity with vacuum negative pressure, which ensures even stress distribution and improves preparation efficiency by forming an integral composite panel with a large area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single-sided design is adopted in panel-level package technology, then the structure is simpler, but uneven stress distribution occurs leading to warping and reduced preparation efficiency
Solution Approach 1:
The patent transitions from a single-sided asymmetric design to a double-sided symmetric design where temporary carriers are disposed on both sides of the bonding layer. This symmetry ensures even stress distribution during the bonding process, effectively preventing warping and improving manufacturing precision without significantly increasing overall structural complexity.
2Device complexity
If a single-sided design is adopted in panel-level package technology, then the structure is simpler, but preparation efficiency is reduced and costs increase
Solution Approach 1:
The patent extends the bonding structure from a single-sided (2D surface bonding) to a double-sided (3D volumetric bonding) configuration. By disposing temporary carriers on both sides of the bonding layer and forming bonding cavities that extend through the bonding layer, the structure achieves more uniform stress distribution and improved preparation efficiency, effectively utilizing the third dimension to resolve the contradiction between simplicity and productivity.
3Productivity
If integral package with large area is achieved, then package efficiency is improved and cost is reduced, but stress distribution becomes uneven causing warping
Solution Approach 1:
The patent employs a double-sided symmetric design where temporary carriers on opposite sides of the bonding layer act as counterbalancing elements. This configuration creates balanced stress distribution across the large-area integral package structure, preventing warping while maintaining the benefits of high package efficiency and reduced costs associated with large-area integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively reduces warping, enhances preparation efficiency, and lowers costs by achieving a flat integral composite panel with improved bonding stability and separation efficiency, while accommodating more I/O ports and heterogeneous chips in a compact form.
Implementation Method 1
a bonding layer; and a first temporary carrier and a second temporary carrier oppositely disposed on both sides of the bonding layer. Both the first temporary carrier and the second temporary carrier are connected to the bonding layer
Implementation Method 2
at least one bonding cavity is jointly formed by the bonding layer, the first temporary carrier and the second temporary carrier
Data Source
AI summary
A panel-level package structure includes a bonding layer; and a first temporary carrier and a second temporary carrier oppositely disposed on both sides of the bonding layer. Both the first temporary carrier and the second temporary carrier are connected to the bonding layer, and at least one bonding cavity is jointly formed by the bonding layer, the first temporary carrier and the second temporary carrier, so that integral package with a relatively large area may be achieved, which further improves package efficiency, thus reducing a package cost. A package structure with a double-sided symmetrical design may make products evenly stressed, which not only effectively solves problems of warping in products, but also greatly improves preparing efficiency, thus reducing a cost.