Panel-to-PCB Adhesive Layout for Reliable Connection Inspection
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Solution Overview
Problem
Existing electronic apparatuses face challenges in ensuring reliable connections between electronic panels and circuit boards, leading to potential errors in inspection due to stable electrical connections masking defective physical connections.
Innovation Solution
The electronic apparatus incorporates a conductive adhesive member with a specific arrangement of pads and leads, including resistance measurement pads and leads, and dummy pads and leads, to provide a predetermined separation distance and enhance inspection reliability by preventing false positives in connection failure detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive adhesive member is used to electrically connect the circuit board and electronic panel, then electrical connection is achieved, but false positives in connection failure detection may occur due to stable electrical connection masking defective physical connection
Solution Approach 1:
The invention segments the connection inspection into two independent parts: electrical connection inspection (through pixel pads/leads) and physical connection inspection (through arrangement pads/leads). By separating these inspection functions, the system can independently verify both electrical conductivity and physical bonding quality, preventing false positives where stable electrical connection masks defective physical connection.
Solution Approach 2:
The invention introduces arrangement pads and arrangement leads as intermediary elements that do not carry electrical signals but serve solely for physical connection inspection. These intermediary components enable independent verification of bonding quality through resistance measurement, acting as a mediator between the conductive adhesive member and the inspection system.
2Area of stationary object
If arrangement pad and pixel pads are closely arranged for compact design, then device compactness is improved, but inspection accuracy deteriorates due to potential interference between measurement signals
Solution Approach 1:
The invention applies local quality by giving different functional characteristics to different regions of the adhesive area. The arrangement pads are designed with specific spacing and positioning to create localized measurement zones that are functionally distinct from the pixel pads. This local differentiation ensures that resistance measurement signals remain accurate even when the overall adhesive area is compact.
3Productivity
If resistance measurement pad is placed close to pixel pads for efficient space utilization, then manufacturing efficiency is improved, but measurement reliability deteriorates due to potential signal interference
Solution Approach 1:
The invention extracts the resistance measurement function from the electrical connection inspection system by using separate arrangement pads and leads. This extraction allows the resistance measurement pads to be positioned in locations optimized for measurement reliability, independent of the pixel pad arrangement, while still maintaining manufacturing efficiency through integrated processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases the reliability of connection inspections by accurately distinguishing between stable and defective connections, reducing errors and improving manufacturing efficiency.
Implementation Method 1
A conductive adhesive member is disposed on the adhesive area and is configured to electrically connect the circuit board and the electronic panel
Data Source
AI summary
An electronic apparatus includes an electronic panel including a plurality of pads, a circuit board including a plurality of leads, and a conductive adhesive member configured to electrically connect the circuit board and the electronic panel. The plurality of pads include a plurality of pixel pads, an arrangement pad, and a resistance measurement pad disposed between the arrangement pad and the pixels pads and insulated from the pixel pads. The plurality of leads include a plurality of pixel leads, an arrangement lead, and a resistance measurement lead disposed between the pixel leads and the arrangement lead and insulated from the pixel leads. The resistance measurement lead includes a plurality of resistance measurement leads disposed between the arrangement lead and the pixel leads and electrically connected with the resistance measurement pad, and a dummy lead spaced apart from the plurality of resistance measurement leads in a plan view.