Light-Emitting Panel Reflective Layer Protection Against Yellowing
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Solution Overview
Problem
The reflective layer in light-emitting panels, particularly in Mini LED and Micro LED panels, prone to yellowing due to oxidation during bonding and light-emitting processes, leading to reduced light-outputting effect and moisture intrusion causing corrosion.
Innovation Solution
Incorporating a protective layer between the substrate and reflective layer with openings for bonding points, using materials like silicon nitride or magnesium oxide to provide anti-oxidation and moisture isolation, and employing a layered structure with different refractive indices to maintain reflectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a reflective layer is applied on the substrate surface to improve light-outputting effect, then light reflection is enhanced, but the reflective layer is prone to yellowing during bonding process
Solution Approach 1:
The patent introduces a protective layer as an intermediary between the substrate and the reflective layer. This protective layer acts as a barrier that prevents direct exposure of the reflective layer to oxidizing environments during bonding and light-emitting processes, thereby preventing yellowing while maintaining the reflective layer's light reflection function.
Solution Approach 2:
The protective layer is formed on the substrate surface before the reflective layer is applied. This preliminary protective action ensures that the reflective layer is never directly exposed to harmful environments, preventing yellowing before it can occur during subsequent bonding and operation processes.
2Reliability
If the reflective layer is covered completely to prevent yellowing, then oxidation is prevented, but bonding points cannot be accessed for electrical connection
Solution Approach 1:
The protective layer and reflective layer are both provided with openings that segment the continuous layers, exposing the bonding points at specific locations. This segmentation allows the bonding points to be accessed for electrical connection while the rest of the reflective layer remains protected by the protective layer, preventing oxidation and yellowing.
3Ease of operation
If openings are provided in protective layer and reflective layer for bonding points, then electrical connection is enabled, but light reflection may be reduced
Solution Approach 1:
The openings in the protective layer and reflective layer are strategically positioned only at the bonding points where electrical connection is needed. The majority of the reflective layer remains intact and continuous, maintaining its light reflection function. The local discontinuities at bonding points do not significantly affect overall light reflection performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents oxidation and moisture intrusion, enhancing the light-outputting effect while minimizing reflectivity loss, thus improving the performance of the light-emitting panel.
Implementation Method 1
the protective layer can play an anti-oxidation effect, so that oxidation of the reflective layer can be reduced or even avoided
Implementation Method 2
the protective layer can play an anti-oxidation effect and/or a moisture isolation effect
Data Source
AI summary
A light-emitting panel, a method for fabricating a light-emitting panel, and a display device are provided in embodiments of the present application. The light-emitting panel includes: a substrate, and a plurality of light-emitting elements, a reflective layer and a protective layer that are disposed at a side of the substrate, wherein the reflective layer is located between the substrate and the protective layer; and wherein both the protective layer and the reflective layer are provided with openings, the substrate includes bonding points within the openings, and the light-emitting elements are electrically connected to the bonding points.