Panel Substrate Regional Cooling for Uniform LED Temperature Control
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Solution Overview
Problem
Existing electronic apparatuses face challenges in uniformly cooling large panel substrates with mounted LED elements, leading to temperature differences and potential failures due to condensation or insufficient cooling.
Innovation Solution
A method and apparatus that include temperature detectors in measurement regions and temperature adjusters with independent cooling units in adjustment regions, allowing for individual temperature adjustments based on detected temperatures, using a cooling member with medium flow channels and a controller to manage the circulation of a cooling medium.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single cooling system is used for the entire panel substrate, then the device complexity is reduced, but temperature uniformity deteriorates leading to hot spots and condensation
Solution Approach 1:
The cooling system is divided into multiple independent cooling units, each responsible for a specific region of the panel substrate. Each cooling unit includes its own cooling element and temperature detector, enabling localized temperature control to prevent hot spots and condensation while maintaining overall system manageability
Solution Approach 2:
Different regions of the panel substrate are provided with different cooling intensities based on their specific thermal characteristics and heat generation patterns. The controller adjusts each cooling unit independently according to local temperature conditions, ensuring optimal cooling performance for each region rather than applying uniform cooling across the entire panel
2Temperature
If multiple independent cooling units are used for different regions, then temperature uniformity is improved, but device complexity increases
Solution Approach 1:
Multiple cooling units share common functional components including the controller that manages all cooling units, the housing that contains the entire cooling system, and the medium supply unit that provides cooling medium to all cooling elements. This multi-functional design achieves regional temperature control while reducing overall system complexity through component sharing
Solution Approach 2:
The controller integrates the control functions for all cooling units into a single control unit that receives temperature information from multiple detectors and coordinates the operation of multiple cooling elements. The housing merges all cooling components into a unified structure, and the medium supply unit combines the supply function for all cooling elements, reducing the number of separate components
3Device complexity
If uniform cooling is applied across the entire panel, then device complexity is reduced, but reliability deteriorates due to condensation and insufficient cooling in specific regions
Solution Approach 1:
Each cooling unit is equipped with a temperature detector that continuously monitors the local temperature and provides feedback to the controller. The controller uses this feedback information to dynamically adjust the cooling operation of each unit, ensuring that cooling is applied only where and when needed, thereby preventing condensation and insufficient cooling while maintaining system reliability
Solution Approach 2:
The cooling system transitions from a static uniform cooling approach to a dynamic regional control approach where each cooling unit can independently adjust its operation based on real-time temperature conditions. This dynamic adjustment capability allows the system to respond to changing thermal conditions and prevent reliability issues such as condensation and overheating
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise temperature control across the panel substrate, preventing overcooling or undercooling, thus ensuring uniform cooling and preventing failures like condensation, while maintaining optimal performance of the LED elements.
Implementation Method 1
a plurality of temperature detectors provided in a plurality of measurement regions set on the panel substrate and configured to detect temperatures of the panel substrate
Implementation Method 2
a cooling member with medium flow channels and a controller to manage the circulation of a cooling medium
Implementation Method 3
circulation of a cooling medium
Data Source
AI summary
A technique for more appropriately adjusting a temperature of an electronic apparatus is provided. Temperatures of a panel substrate are detected in a plurality of measurement regions set in the panel substrate, and temperatures in a plurality of adjustment regions set in the panel substrate are individually adjusted in accordance with the temperatures of the panel substrate detected in the plurality of measurement regions.