Panel Test Circuit Signal Access via Direct Bonding
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Solution Overview
Problem
Existing display device panel test circuits face excessive impedance issues due to over-length wiring, which prevents effective driving of data lines in high-density display images, leading to abnormal display operations.
Innovation Solution
The implementation of a panel test circuit with thin-film transistors and bonding pads on a substrate, where data detection signals are transmitted directly to data lines through COF Bonding Pads, reducing the need for detour wiring and minimizing impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the panel detection circuit uses over-length wiring to connect from the edge of the substrate to the pixel array region, then the circuit can provide signal access, but the resistance of the wiring becomes very high causing excessive impedance
Solution Approach 1:
The patent moves the panel detection circuit from the edge of the substrate to the front end area of the pixel array region, changing the spatial dimension of circuit placement. This repositioning shortens the wiring path from detouring around the edge to direct connection at the front end, thereby reducing wiring resistance and impedance while maintaining signal access capability
Solution Approach 2:
The patent integrates the panel detection circuit with the driver circuit at the front end of the pixel array, performing detection functions before signal transmission. This preliminary integration allows detection signals to be generated close to the pixel array, avoiding long wiring paths and reducing impedance effects on the detection system
2Device complexity
If one line of the panel detection circuit drives multiple data lines, then the circuit complexity is reduced, but the resistance capacitance reflects a large negative RC load effect
Solution Approach 1:
The patent segments the detection signal transmission by providing separate detection signal lines for different data line groups. Instead of one detection line driving all data lines, the detection circuit is divided into multiple independent signal paths, each with controlled impedance and capacitance loading, thereby reducing the RC load effect while maintaining circuit manageability
Solution Approach 2:
The patent implements different detection circuit configurations for different regions of the pixel array. Each detection circuit is optimized for its specific local requirements, with wiring and signaling tailored to the local data line density and capacitance characteristics, reducing overall RC effects while maintaining comprehensive detection coverage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces path resistance and enhances detection rates, ensuring accurate light reflection from the panel display area, thereby improving test efficiency and avoiding excessive wiring impedance issues.
Implementation Method 1
a panel test circuit with thin-film transistors and bonding pads on a substrate, where data detection signals are transmitted directly to data lines through COF Bonding Pads, reducing the need for detour wiring and minimizing impedance
Data Source
AI summary
The present patent application is related to the field of display devices, and provides a display device with panel test circuit the attenuation of data voltage signal could be reduced in the programs of testing pixel array. The display device comprises a plurality of first and second type of bonding pads located on the substrate and around periphery of the pixel array, and the panel test circuit has transistors, the transistors are disposed on the substrate and around periphery of the pixel array, a plurality of data lines of the pixel array are electrically connected with the second type of bonding pads one-to-one, and data detection signal applied to the first type of bonding pads is transmitted to the second type of bonding pads through the panel test circuit.