Panel-Type Lid for 3D IC Package Bulk Handling
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Solution Overview
Problem
Current methods for forming 3D integrated circuit packages are inefficient in handling and processing multiple devices due to individual packaging, which limits throughput and consistency in heat dissipation and protection.
Innovation Solution
A method involving a panel-type lid arrangement where multiple device stacks are mounted on a panel with heat conductive lids, separated by dicing streets, allowing for bulk handling and efficient separation into individual packages, utilizing heat conductive materials like copper or aluminum with coatings for corrosion prevention and enhanced bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If individual packaging methods are used for 3D integrated circuit devices, then each device can be handled separately, but processing throughput is limited and manufacturing time increases
Solution Approach 1:
Multiple device stacks are mounted simultaneously on a single lid to form a combined package unit. This merging approach allows bulk handling and processing of multiple devices together, significantly increasing throughput compared to individual packaging while reducing total manufacturing time.
Solution Approach 2:
The lid is designed with dicing streets that divide it into multiple sections, each accommodating a device stack. This segmentation allows the lid to be divided into individual packages after the devices are mounted and tested, providing flexibility in packaging configuration while maintaining efficiency benefits during the assembly process.
2Quantity of substance
If multiple devices are stacked vertically to reduce footprint, then integration density increases, but heat dissipation becomes more challenging
Solution Approach 1:
A lid is introduced as an intermediary component between the stacked devices and the external environment. The lid provides a dedicated thermal pathway and heat dissipation structure that actively manages the heat generated by vertically stacked devices, preventing temperature buildup while maintaining high integration density.
3Manufacturing precision
If dicing streets are used to separate lids into individual packages, then singulation precision can be maintained, but the lid structure becomes more complex
Solution Approach 1:
The lid is designed with integrated dicing streets that create distinct sections for individual device stacks. These dicing streets are incorporated directly into the lid structure during manufacturing, allowing precise separation into individual packages while maintaining a relatively simple overall lid design that does not require additional complex components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases processing throughput and consistency by enabling bulk handling of packages with lids, improving heat dissipation and protection while maintaining precision in singulation, resulting in enhanced device performance and reduced manufacturing time.
Implementation Method 1
The lid protects the dies and provides a path to conduct heat away from the dies
Data Source
AI summary
Presented herein is a package comprising a carrier device of a device stack and at least one top device of the device stack mounted on a first side of the carrier device. A lid is mounted on the first side of the carrier device, with a first portion of the lid attached to the carrier device and a second portion of the lid extending past and overhanging a respective edge of the carrier device. The lid comprises a recess disposed in a first side, and the at least one top device is disposed within the recess. A thermal interface material disposed on the top device and contacts a surface of the recess.