Injection-Molded Panel Assembly to Prevent Wiring Gaps
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Solution Overview
Problem
Existing panel manufacturing technologies face issues such as the formation of gaps between the molded body and the circuit film, leading to potential water intrusion and quality deterioration, as well as complex apparatus configurations and increased manufacturing time and cost due to the need for double injection molding.
Innovation Solution
A panel design that includes an insulating film, a molding resin integrally formed with the insulating film by injection molding, an electric circuit on the back surface of the insulating film, and a flexible wiring board with both surfaces coated in adhesive resin, which enhances adhesion and reduces gap formation between the wiring board and the molding resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wiring is arranged between the molded body and the circuit film, then the electric circuit can be formed, but a gap is formed between the molded body and the circuit film allowing water to enter
Solution Approach 1:
The patent introduces a flexible wiring board as an intermediary component between the molded body and the circuit film. This wiring board is coated with adhesive resin on both surfaces to ensure proper adhesion and eliminate gaps, thereby preventing water intrusion while maintaining electrical connectivity.
Solution Approach 2:
The patent changes the physical and chemical parameters of the wiring board by coating both surfaces with adhesive resin. This modification ensures strong bonding between the wiring board and the molded body, eliminating gaps and improving water resistance without compromising manufacturing precision.
2Manufacturing precision
If double injection molding is used to fill the mold, then the molded body can be formed with the circuit film, but the apparatus configuration and manufacturing process become complicated
Solution Approach 1:
The patent segments the manufacturing process into two independent stages: first, injection molding the molded body separately; second, assembling the circuit film and flexible wiring board onto the molded body. This segmentation eliminates the need for complex double injection molding apparatus while maintaining integral molding quality through controlled assembly with adhesive bonding.
3Manufacturing precision
If double injection molding is used to fill the mold, then the molded body can be formed with the circuit film, but manufacturing time and cost increase
Solution Approach 1:
The patent divides the manufacturing process into separate, independently optimized stages: molded body production followed by assembly of electronic components. This allows each stage to use the most efficient process for that specific task, reducing total manufacturing time while maintaining quality through controlled assembly procedures.
Solution Approach 2:
The patent performs preliminary preparation of the flexible wiring board by coating both surfaces with adhesive resin before assembly. This preliminary action ensures proper bonding during assembly, eliminating the need for rework and reducing overall manufacturing time while maintaining integral molding quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the production of high-quality panels at a lower cost and in less time, while minimizing the risk of water intrusion and improving the structural integrity of the panel.
Implementation Method 1
both surfaces of the flexible wiring board are coated with an adhesive resin
Implementation Method 2
a molding resin integrally formed with the insulating film by injection molding
Data Source
AI summary
A panel includes: an insulating film; a molding resin integrally formed with the insulating film by injection molding; an electric circuit provided on a back surface of the insulating film; and a flexible wiring board that includes a connecting part connected to a connection terminal of the electric circuit at one end of the connecting part and that extends from a rear surface of the molding resin through the molding resin. Both surfaces of the flexible wiring board are coated with an adhesive resin.