Paper-Based Electronic Circuit Embedding in Injection Molded Plastic
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Solution Overview
Problem
Current methods for integrating electronic circuits into plastic pieces are limited by high costs, time-consuming processes, and poor adhesion and thermal stability of plastic films, which restrict the flexibility and efficiency of embedding electronic components within plastic products, especially in the context of IoT applications.
Innovation Solution
The use of paper-based substrates with special inks and coatings, such as PowerCoat papers, allows for the direct embedding of electronic circuits into plastic pieces during the molding process without additional steps, enhancing adhesion and thermal stability, and enabling the production of flexible, lightweight plastic objects with integrated electronic features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If plastic films are used as substrates for electronic circuits, then adhesion to plastic pieces is improved, but thermal stability deteriorates due to degradation at sintering temperatures
Solution Approach 1:
The patent changes the substrate material from plastic film to paper-based substrate, fundamentally altering the thermal properties to withstand sintering temperatures while maintaining adhesion capabilities through surface treatments and coatings
Solution Approach 2:
The patent uses composite paper-based substrates with special coatings that combine the thermal stability of paper with adhesion-promoting surface treatments, creating a material that exhibits both high thermal resistance and strong bonding properties
2Device complexity
If direct printing of electronic functionalities on plastic parts is performed, then integration is simplified, but manufacturing cost increases and production time is extended
Solution Approach 1:
The patent prepares paper-based substrates with pre-applied special inks and coatings before the molding process, allowing electronic circuits to be printed and sintered in advance, then integrated into plastic pieces without extending production time
Solution Approach 2:
The patent replaces traditional mechanical assembly methods with direct printing and sintering techniques on paper substrates, followed by integration into molded plastic pieces, streamlining the manufacturing process
3Stability of the object's composition
If plastic films are used as substrates, then flexibility is maintained, but print definition quality deteriorates compared to paper substrates
Solution Approach 1:
The patent changes the substrate material from plastic film to paper-based substrate, which inherently provides superior print definition while maintaining flexibility through careful selection of paper types and thicknesses
4Reliability
If electronic components are embedded between substrate and laminated film, then circuit protection is improved, but manufacturing complexity increases and flexibility is reduced
Solution Approach 1:
The patent removes the lamination step from the manufacturing process by using paper-based substrates that provide inherent circuit protection and stability, eliminating the need for additional protective films and simplifying the overall structure
Data Source
AI summary
The invention relates to a method to embed a label essentially consisting of a paper substrate carrying electronic inks and/or a printed electronic circuit and/or device (thereby achieving a paper-based electronic circuit) directly into a moulded plastic piece (also designated as plastic object), the embedding of the paper-based electronic circuit and the production of the plastic piece being performed in a single operation. The invention thus also relates to a method to manufacture plastic objects embedding such label. The invention also concerns a plastic object encompassing a label essentially consisting of a paper substrate carrying electronic inks and/or a printed electronic circuit and/or device (thereby achieving a paper-based electronic circuit) embedded in the moulded plastic and in particular an object obtained by the method disclosed to prepare a moulded plastic piece.