Packaging Paperboard with Integrated RFID Antenna and RFIC

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Solution Overview

Problem

The manufacturing cost of RFID tags attached to packages is high due to the configuration of radio frequency integrated circuit (RFIC) elements and metal film antennas, limiting efforts to reduce costs for product management efficiency.

Innovation Solution

Integrating RFIC elements and antenna patterns into a packaging paperboard by printing patterns on one layer and adhering RFIC elements to another layer, then electrically connecting them to form an RFIC device within the paperboard, allowing for non-contact communication.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If RFID tags are individually attached to packages using separate RFIC elements and metal film antennas, then wireless communication functionality is achieved, but manufacturing cost increases

Engineering Contradiction:

Improvewireless communication functionalityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the RFIC element and antenna pattern into a single integrated structure by forming the antenna pattern directly on the same substrate as the RFIC element. This integration eliminates the need for separate components and their individual attachment processes, thereby reducing manufacturing cost while maintaining wireless communication functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The substrate serves multiple functions: it acts as both the mounting platform for the RFIC element and the medium for forming the antenna pattern. This multi-functionality reduces the total component count and simplifies the manufacturing process, addressing the cost issue while preserving RFID functionality.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Productivity

If separate RFID tags are attached to packages, then product management efficiency is improved, but the complexity of the packaging system increases

Engineering Contradiction:

Improveproduct management efficiencyVSAvoidpackaging system complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The packaging structure and RFID tag are merged into a single integrated component. The antenna pattern is formed directly on the packaging substrate, eliminating the need for separate tag attachment. This reduces packaging system complexity while maintaining product management efficiency through wireless communication capability.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If metal film antennas are used on base films with RFIC elements, then RFID functionality is achieved, but the number of manufacturing steps increases

Engineering Contradiction:

ImproveRFID functionalityVSAvoidmanufacturing efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The antenna pattern formation and RFIC element mounting are merged into a single manufacturing process step. By forming the antenna pattern directly on the substrate where the RFIC element is already mounted, the patent eliminates separate antenna fabrication and attachment steps, thereby improving manufacturing efficiency while maintaining RFID functionality.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS11100378B2Packaging paperboard and method for manufacturing same

Publication Date: 2021.08.24 MURATA MFG CO LTD

AI summary

A packaging paperboard is provided that includes two or more layers with an antenna pattern printed on one layer of the two or more layers, and an RFIC element adhered to the other layer of the two or more layers. In a laminate having the layers stuck together, the RFIC element and the antenna pattern are interposed between the layers to configure an RFIC device in which the RFIC element and the antenna pattern are electrically connected.