Parallel Adhesive Coating Mechanism for Carrier Tape Packaging
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Solution Overview
Problem
Conventional adhesive dispensing technologies using a fixed flow rate lead to excessive adhesive application and quality issues in electronic component packaging due to mismatched adhesive application and packaging movements.
Innovation Solution
A parallel method and mechanism where a first strip passes through an application unit for continuous adhesive application and a combining unit for intermittent, stepwise bonding, with differential movement states and adhesive drying to prevent excessive application and ensure quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If adhesive is output at a fixed flow rate continuously, then the adhesive application process is simple and easy to control, but excessive adhesive is applied during pause periods causing waste and quality issues
Solution Approach 1:
The adhesive dispensing system is converted from continuous operation to periodic operation, where the adhesive is dispensed only during active packaging periods and stopped during pause periods. This periodic action eliminates adhesive waste during pauses while maintaining simple operation through automated control that synchronizes dispensing with the packaging cycle.
2Manufacturing precision
If the lower strip moves intermittently to match electronic component placement, then packaging quality is maintained, but continuous adhesive output causes excessive local application during pauses
Solution Approach 1:
The adhesive dispensing is synchronized to operate periodically only during the active movement phases of the lower strip, matching the packaging cycle. During intermittent pause periods when the lower strip stops for component placement, the adhesive dispensing also stops, preventing excessive local application while maintaining packaging precision.
Solution Approach 2:
The system implements feedback control where the adhesive dispensing is activated or deactivated based on the real-time state of the packaging process. When the lower strip is moving and components are being packaged, adhesive is dispensed; when the strip pauses for component placement, dispensing is stopped, ensuring precise adhesive application without waste.
3Device complexity
If adhesive is applied continuously at fixed flow rate, then the application process is simple, but it cannot match the intermittent movement of the lower strip during packaging
Solution Approach 1:
The adhesive dispensing system operates periodically in sync with the packaging cycle, being active during movement phases and inactive during pause phases. This periodic operation provides adaptability to the intermittent movement of the lower strip while keeping the system relatively simple through automated cycle-based control.
Solution Approach 2:
The adhesive dispensing system transitions from a static continuous operation to a dynamic operation that adapts to the varying states of the packaging process. The dispensing is dynamically activated during movement phases and deactivated during pause phases, enabling the system to match the intermittent movement of the lower strip.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach regulates adhesive output and movement to prevent excessive application, ensuring consistent packaging quality and reducing waste, while maintaining efficient adhesive use and control.
Implementation Method 1
an adhesive on the to-be-used segment is dried, and the adhesive may be dried immediately after the application procedure is performed
Data Source
AI summary
The present invention provides a parallel method for packaging an electronic component and coating an adhesive on a carrier tape and a mechanism for same, so as to regulate continuous output of an adhesive and intermittent movement in packaging work, so that during a short pause of placing an electronic component, a continuously output adhesive is prevented from being repeatedly applied at a fixed position of a carrier tape. In this way, excessive application of an adhesive can be avoided, and it can be further ensured that the quality of packaging is not affected by an excessive amount of an adhesive.