Parallel Backplane Heat Dissipation for High-Density Electronics
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Solution Overview
Problem
Existing electronic devices with parallel backplanes face challenges in achieving effective heat dissipation, leading to potential damage from excessive temperatures and reduced operational efficiency due to limited airflow and increased density of functional units.
Innovation Solution
The design incorporates a backplane assembly with backplanes arranged in parallel and intersecting units, allowing for unobstructed airflow through channels between them, enabling efficient heat dissipation without the need for clearance, and facilitating increased density and connectivity of units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If backplanes are arranged in parallel with high density, then the quantity of functional units connected is improved, but heat dissipation deteriorates due to limited airflow
Solution Approach 1:
The patent transitions from a single-plane arrangement to a three-dimensional structure with backplanes arranged in parallel at intervals, creating channels for airflow. This spatial reconfiguration allows heat dissipation channels to exist between adjacent backplanes while maintaining high connection density, effectively resolving the contradiction between quantity and thermal management.
2Quantity of substance
If backplanes are arranged closely to increase density, then the quantity of functional units is improved, but airflow is blocked reducing heat dissipation
Solution Approach 1:
The patent segments the backplane assembly into multiple parallel backplanes with intervals between them, creating dedicated heat dissipation channels. This segmentation allows airflow to pass through the structure without being blocked, while still maintaining high functional unit density through the parallel arrangement.
3Temperature
If clearance is reserved for heat dissipation, then heat dissipation is improved, but the quantity of connected units is reduced
Solution Approach 1:
The patent utilizes the third dimension (depth/interval between parallel backplanes) to accommodate heat dissipation channels, rather than reserving clearance in the two-dimensional plane. This allows functional units to be densely packed on the backplane surfaces while maintaining adequate airflow paths between the parallel backplanes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation, reduces the risk of damage from temperature, and improves operational capability by allowing more units to be connected without compromising airflow, thus addressing the limitations of prior art.
Implementation Method 1
there is a channel between adjacent backplanes... achieves a good heat dissipation effect... airflow can pass through the channel
Data Source
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AI summary
This application provides an electronic device with parallel backplanes and a storage device with parallel backplanes. The storage device is a specific embodiment of the electronic device. The electronic device includes a front inserting assembly, a rear inserting assembly, and a backplane assembly. The backplane assembly is connected to the front inserting assembly and the rear inserting assembly. The backplane assembly includes a plurality of backplanes arranged in parallel at intervals, the front inserting assembly includes a plurality of first units whose arrangement direction is the same as an arrangement direction of the backplanes, and the rear inserting assembly includes a plurality of second units whose arrangement direction intersects the arrangement direction of the backplanes. The backplane assembly is provided with the structure including the plurality of backplanes arranged in parallel at intervals and the channel between adjacent backplanes, so that an airflow can pass through the channel, to achieve a good heat dissipation effect in the electronic device. In addition, the first units and the second units are connected to two opposite sides of the backplanes, respectively. Therefore, there is no need to reserve a clearance, and density of the first units and/or the second units in the electronic device can be increased.