Parallel System and Power Board Cable-Free Interconnection
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Solution Overview
Problem
The increasing complexity of power supply connections for electronic packages on system boards leads to potential interference with heat sinks, necessitating a cable-free interconnection solution.
Innovation Solution
A cable-free connection mechanism is achieved by mounting a system board and power board in parallel, with connector units on both boards and a heat sink positioned to directly contact the electronic package, allowing power supply through mated connectors and connector units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If additional cable is used to extend power supply connections, then power supply capability is improved, but risk of interference with heat sink increases
Solution Approach 1:
The patent extracts and eliminates the cable from the power supply connection system. Instead of using cables to connect power boards to electronic packages, the invention integrates power connection terminals directly onto the system board, allowing direct electrical contact without intermediate cable components. This removes the source of interference while maintaining power supply capability.
Solution Approach 2:
The patent merges the power connection function with the system board structure itself. Power connection terminals are integrated directly into the board layout, combining the functions of structural support and electrical connection in a single unified component, thereby eliminating the need for separate cable assemblies that could interfere with heat sinks.
2Object-affected harmful factors
If cable-free connection mechanism is implemented, then cable interference is eliminated, but connection complexity increases
Solution Approach 1:
The system board is designed with multi-functional integration, serving simultaneously as structural support, signal transmission medium, and power distribution platform. The power connection terminals are standardized components that can accommodate multiple power connection points, reducing overall system complexity despite the cable-free requirement.
Solution Approach 2:
The patent transitions from three-dimensional cable routing through space to two-dimensional planar connections on the board surface. Power connection terminals are arranged in optimized patterns on the system board plane, eliminating the need for vertical cable management and reducing spatial complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration eliminates cable interference risks, ensuring reliable power supply to electronic packages while maintaining thermal contact with heat sinks, enhancing system stability and efficiency.
Implementation Method 1
a heat sink is positioned upon the power board and contacts the electronic package via a center opening in the power board
Data Source
AI summary
An electrical assembly includes a system board and a power board closely arranged with each other in a parallel relation. An electronic package and a system connector are mounted upon an upper surface of the system board. A power connector and a set of connector units are mounted on an undersurface of the power board. Another set of connector units are formed on an upper surface of the electronic package. A heat sink is positioned upon the power board and contacts the electronic package via a center opening in the power board. After assembled, the power supply is provide through connection between the two sets of the connector units and that between the system connector and the power connector.