Parallel Busbar Power Module Layout for Compact Integration
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Solution Overview
Problem
Existing power modules face challenges in achieving high integration levels while ensuring performance and reducing manufacturing costs.
Innovation Solution
The power module design optimizes structural layouts by arranging DC+, AC, and DC− busbars parallel to each other, with upper and lower bridge power chips distributed linearly between these busbars, and gate busbars positioned adjacent to key connections, enhancing compactness and reducing element distances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If elements with better performance are selected to guarantee performance and reliability, then performance and reliability are improved, but manufacturing cost increases
Solution Approach 1:
The patent transitions from traditional planar arrangement to a three-dimensional stacked configuration where power chips are vertically arranged between parallel busbars. This spatial reconfiguration reduces the number of elements required while maintaining electrical performance, thereby lowering manufacturing cost without sacrificing reliability
2Volume of moving object
If the number of elements is reduced to optimize structure, then size is reduced, but performance and reliability are sacrificed
Solution Approach 1:
The patent merges multiple electrical connections into integrated busbar structures that simultaneously serve multiple functions. The parallel busbar arrangement combines power transmission and grounding functions, reducing the total number of discrete elements while maintaining system reliability through consolidated design
3Ease of manufacture
If traditional in-line elements are used, then manufacturing is simpler, but integration level is lower and size is larger
Solution Approach 1:
The patent employs vertical stacking of power chips between parallel busbars, transitioning from horizontal in-line arrangement to three-dimensional configuration. This dimensional change achieves higher integration density and compact size while maintaining manufacturing feasibility through standardized assembly processes
Data Source
AI summary
A power module includes a power chip, and DC+, AC, and DC− busbars arranged substantially parallel to one another, where upper bridge power chips are linearly distributed between the DC+ and the AC busbars, and lower bridge power chips are linearly distributed between the AC and the DC− busbars, where each upper bridge power chip has a drain electrically connected to the DC+ busbar, a source electrically connected to the AC busbar, and a gate connected to a first gate busbar, where the first gate busbar is immediately adjacent to a connection between the source and AC busbar; and each lower bridge power chip has a drain electrically connected to the AC busbar, a source electrically connected to the DC− busbar, and a gate connected to a second gate busbar, where the second gate busbar is immediately adjacent to a connection between the source and the DC− busbar.