Parallel Color Photodiode Packaging for Fault-Tolerant Display Screens
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Solution Overview
Problem
Existing color photodiodes are limited to series communication, leading to failure of the entire display screen if one or more diodes are damaged, and those with backup communication functions are too complex for small-size applications.
Innovation Solution
A manufacturing method for color photodiodes in parallel communication, involving an integrated support with multiple single modules, each containing visible light emitting chips and a color control chip, connected via pins and bonding wires, packaged with adhesive, and cured to form independent photodiodes that can operate in parallel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If color photodiodes use series communication to simplify structure and improve efficiency, then manufacturing complexity is reduced, but reliability deteriorates because one damaged diode causes entire circuit failure
Solution Approach 1:
The patent divides the communication circuit into multiple independent parallel channels, where each color photodiode has its own dedicated communication path to the control chip. This segmentation ensures that damage to one diode does not affect others, resolving the reliability issue while maintaining manufacturing simplicity through modular design
Solution Approach 2:
The patent implements a backup communication mechanism where reserved communication pins and circuits are prepared in advance. When a primary communication path fails, the system can automatically switch to backup paths, providing fault tolerance without requiring complex real-time decision-making circuits
2Reliability
If color photodiodes are equipped with backup communication function to improve reliability, then circuit reliability is improved, but device complexity increases making small-size packaging impossible
Solution Approach 1:
The control chip is designed with universal communication interfaces that can handle both normal operation and fault conditions through the same physical pins. The chip can dynamically configure communication paths based on detected failures, eliminating the need for separate dedicated backup communication hardware and reducing overall device complexity
Solution Approach 2:
The communication system implements dynamic path selection where the control chip continuously monitors communication status and automatically switches between primary and alternative communication routes based on real-time conditions. This dynamic adaptation allows the system to maintain reliability without requiring complex static backup circuitry
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures normal operation of the display screen even if one or more photodiodes fail, allows small-size packaging, and enables separate gray-scale and cascade control, suitable for precision electronic products.
Implementation Method 1
The said visible light emitting chip, the color control chip, and the pins are welded with the bonding wire to form the electric control loop
Implementation Method 2
The said packaging cavities are dispensed with the packaging adhesive, so as to package the said visible light emitting chip and color control chip into the said packaging adhesive
Implementation Method 3
The integrated support after curing and molding is cut into a plurality of color photodiodes
Data Source
AI summary
In a manufacturing method for the color photodiodes in parallel communication, an integrated support includes a plurality of single support modules; on each single support module, there is a base and a plurality of pins installed thereon, and there are packaging cavities on the base; in each packaging cavity, the visible light emitting chip and the color control chip are fixed and installed; the color control chip is the three-channel parallel-driven chip; the three-channel parallel-driven chip has three channels, which are used to control and drive the red light emitting chip, the blue light emitting chip, and the green light emitting chip respectively; the visible light emitting chip, the color control chip, and the pins are welded with the bonding wire to form the electric control loop; the packaging cavities are dispensed with the packaging adhesive, and cured and molded; and the integrated support after curing and molding is cut.